Cheal-Sang YOON

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip bonding apparatus
- Patent number 8,042,593
- Issue date Oct 25, 2011
- Samsung Electronics Co., Ltd.
- Cheal-Sang Yoon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for separating chip, a method for fabricating the apparat...
- Publication number 20090035105
- Publication date Feb 5, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Cheal-Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS
- Publication number 20090020229
- Publication date Jan 22, 2009
- Samsung Electronics Co., Ltd.
- Cheal-Sang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus of semiconductor package
- Publication number 20080000587
- Publication date Jan 3, 2008
- Yong-dae Ha
- H01 - BASIC ELECTRIC ELEMENTS