Chee Chiew Chong

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Batu Caves, MY

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Patents Grantslast 30 patents

Information Patent Grant
Topside-cooled semiconductor package with molded standoff
- Patent number 11,239,127
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Edward Myers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Subtractive Metal Structuring on Surface of Semiconductor Package
- Publication number 20240312956
- Publication date Sep 19, 2024
- INFINEON TECHNOLOGIES AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
- Publication number 20210398867
- Publication date Dec 23, 2021
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS