Chee Hong Lee

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual step laser processing of an encapsulant of a semiconductor chi...
- Patent number 11,791,169
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLOATING METAL PORTION AND METHOD FOR MA...
- Publication number 20240343553
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Subtractive Metal Structuring on Surface of Semiconductor Package
- Publication number 20240312956
- Publication date Sep 19, 2024
- INFINEON TECHNOLOGIES AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...
- Publication number 20240006260
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Chee Hong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating an Electrical Device Package Comprising Plat...
- Publication number 20220375883
- Publication date Nov 24, 2022
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
- Publication number 20220102263
- Publication date Mar 31, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Step Laser Processing of an Encapsulant of a Semiconductor Chi...
- Publication number 20210050227
- Publication date Feb 18, 2021
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Chee Hong Lee

Person

Patents Grantslast 30 patents

Semiconductor package with metal posts from structured leadframe

Semiconductor package having a chip carrier with a pad offset feature

Dual step laser processing of an encapsulant of a semiconductor chi...

Semiconductor package having a laser-activatable mold compound

Pressure sensor having a lidless/laminate structure

Semiconductor package with air cavity

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH FLOATING METAL PORTION AND METHOD FOR MA...

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

Subtractive Metal Structuring on Surface of Semiconductor Package

ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

Method for Fabricating an Electrical Device Package Comprising Plat...

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Dual Step Laser Processing of an Encapsulant of a Semiconductor Chi...

Pressure Sensor

Semiconductor Package Having a Laser-Activatable Mold Compound

Semiconductor Package with Air Cavity