Chee Hoo Lee

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Taiping, MY

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIE CONFIGURATION FOR PACKAGING
- Publication number 20070057381
- Publication date Mar 15, 2007
- Chee Wai Wong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit die configuration for packaging
- Publication number 20060094222
- Publication date May 4, 2006
- Chee Wai Wong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package integrated one-quarter wavelength and three-quarter wavelen...
- Publication number 20060001501
- Publication date Jan 5, 2006
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS