Chee Hoo Lee

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit die configuration for packaging
- Patent number 7,714,427
- Issue date May 11, 2010
- Intel Corporation
- Chee Wai Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit die configuration for packaging
- Patent number 7,341,887
- Issue date Mar 11, 2008
- Intel Corporation
- Chee Wai Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package integrated one-quarter wavelength and three-quarter wavelen...
- Patent number 7,081,800
- Issue date Jul 25, 2006
- Intel Corporation
- Jianggi He
- H01 - BASIC ELECTRIC ELEMENTS