Chee Kay CHOW

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer adaptor for adapting different sized wafers
- Patent number 12,165,921
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable semiconductor packages
- Patent number 11,177,301
- Issue date Nov 16, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with processor package
- Patent number 10,566,369
- Issue date Feb 18, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Tim Thian Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,312,240
- Issue date Apr 12, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Kriangsak Sae Le
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240234195
- Publication date Jul 11, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240136217
- Publication date Apr 25, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERE...
- Publication number 20220336283
- Publication date Oct 20, 2022
- UTAC Headquarters Pte. Ltd.
- Enrique Jr Sarile
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS
- Publication number 20220331917
- Publication date Oct 20, 2022
- UTAC Headquarters Pte. Ltd.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20200161351
- Publication date May 21, 2020
- UTAC Headquarters Pte. Ltd.
- Hua Hong TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PROCESSOR PACKAGE
- Publication number 20180182801
- Publication date Jun 28, 2018
- UTAC Headquarters Pte. Ltd.
- Tim Thian Hwee TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150061101
- Publication date Mar 5, 2015
- United Test & Assembly Center Ltd.
- Kriangsak Sae LE
- H01 - BASIC ELECTRIC ELEMENTS

Chee Kay CHOW

Person

Patents Grantslast 30 patents

Wafer adaptor for adapting different sized wafers

Reliable semiconductor packages

Image sensor with processor package

Semiconductor packages and methods of packaging semiconductor devices

Patents Applicationslast 30 patents

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

Semiconductor Device and Method of Making a Substrate with Improved...

Semiconductor Device and Method of Making a Substrate with Improved...

Semiconductor Device Carriers and Methods of Making and Using

WAFER ADAPTORS, INCLUDING SYSTEMS AND METHODS, FOR ADAPTING DIFFERE...

WAFER ADAPTOR FOR ADAPTING DIFFERENT SIZED WAFERS

RELIABLE SEMICONDUCTOR PACKAGES

IMAGE SENSOR WITH PROCESSOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES