Chee-Key Chung

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,100,642
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,881,459
- Issue date Jan 23, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,676,948
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,482,470
- Issue date Oct 25, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, manufacturing method thereof and conductive str...
- Patent number 11,410,954
- Issue date Aug 9, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,315,881
- Issue date Apr 26, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,289,346
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,069,661
- Issue date Jul 20, 2021
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,056,470
- Issue date Jul 6, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, method for fabricating the same, and heat dissi...
- Patent number 10,950,520
- Issue date Mar 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic package carrier structure thereof, and method for fabric...
- Patent number 10,863,626
- Issue date Dec 8, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,763,237
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 10,741,500
- Issue date Aug 11, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,600,708
- Issue date Mar 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,522,500
- Issue date Dec 31, 2019
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate construction and electronic package including the same
- Patent number 10,361,150
- Issue date Jul 23, 2019
- Siliconware Precision Industries Co., Ltd.
- Chee-Key Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,354,891
- Issue date Jul 16, 2019
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20250046771
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240162169
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20230268328
- Publication date Aug 24, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220336323
- Publication date Oct 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220130769
- Publication date Apr 28, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, MANUFACTURING METHOD THEREOF AND CONDUCTIVE STR...
- Publication number 20210320076
- Publication date Oct 14, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210296295
- Publication date Sep 23, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20210287962
- Publication date Sep 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20210280530
- Publication date Sep 9, 2021
- Siliconware Precision Industries Co., Ltd.
- Chi-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20210082837
- Publication date Mar 18, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CARRIER STRUCTURE
- Publication number 20210068260
- Publication date Mar 4, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200402965
- Publication date Dec 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200335447
- Publication date Oct 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSI...
- Publication number 20200168523
- Publication date May 28, 2020
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Yu-Lung Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200091109
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKED STRUCTURE, METHOD FOR FABRICATING THE SAME, AND PAC...
- Publication number 20200043908
- Publication date Feb 6, 2020
- Siliconware Precision Industries Co., Ltd.
- Chee-Key Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20190252344
- Publication date Aug 15, 2019
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190237374
- Publication date Aug 1, 2019
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190181021
- Publication date Jun 13, 2019
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190164861
- Publication date May 30, 2019
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190057917
- Publication date Feb 21, 2019
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONSTRUCTION AND ELECTRONIC PACKAGE INCLUDING THE SAME
- Publication number 20180269142
- Publication date Sep 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chee-Key Chung
- H01 - BASIC ELECTRIC ELEMENTS

Chee-Key Chung

Person

Patents Grantslast 30 patents

Electronic package and fabrication method thereof

Method for fabricating electronic package

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Method for fabricating carrier structure

Method for fabricating electronic package

Electronic package and fabrication method thereof

Electronic package, manufacturing method thereof and conductive str...

Electronic package and manufacturing method thereof

Method for fabricating electronic package

Electronic package

Electronic package and method for fabricating the same

Electronic package, method for fabricating the same, and heat dissi...

Electronic package carrier structure thereof, and method for fabric...

Method for manufacturing electronic package

Electronic package

Electronic package and method for fabricating the same

Method for manufacturing electronic package

Substrate construction and electronic package including the same

Electronic package and method for fabricating the same

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, MANUFACTURING METHOD THEREOF AND CONDUCTIVE STR...

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING CARRIER STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSI...

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

PACKAGE STACKED STRUCTURE, METHOD FOR FABRICATING THE SAME, AND PAC...

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

SUBSTRATE CONSTRUCTION AND ELECTRONIC PACKAGE INCLUDING THE SAME