Chee Ming Lam

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package lead design with grooves for improved dambar separation
- Patent number 11,362,023
- Issue date Jun 14, 2022
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...
- Publication number 20230154827
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A POWER SEMI...
- Publication number 20220115245
- Publication date Apr 14, 2022
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Lead Design with Grooves for Improved Dambar Separation
- Publication number 20210013135
- Publication date Jan 14, 2021
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS