Chee Peng Neo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor workpiece carriers and methods for processing semicon...
- Patent number 8,476,109
- Issue date Jul 2, 2013
- Micron Technology, Inc.
- Chee Peng Neo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked die in die BGA package
- Patent number 8,373,277
- Issue date Feb 12, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor workpiece carriers and methods for processing semicon...
- Patent number 8,011,513
- Issue date Sep 6, 2011
- Micron Technology, Inc.
- Chee Peng Neo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,799,610
- Issue date Sep 21, 2010
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating microelectronic component assemblies employin...
- Patent number 7,691,680
- Issue date Apr 6, 2010
- Micron Technologies, Inc.
- Chee Peng Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die with a recess in a die BGA package
- Patent number 7,575,953
- Issue date Aug 18, 2009
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,371,608
- Issue date May 13, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,358,117
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,344,969
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,819
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,820
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,309,623
- Issue date Dec 18, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die-in-die BGA package with die having a recess
- Patent number 7,282,390
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,282,392
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting topographical features of microe...
- Patent number 7,213,447
- Issue date May 8, 2007
- Micron Technology, Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for detecting topographical features of microe...
- Patent number 6,923,045
- Issue date Aug 2, 2005
- Micron Technology, Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for detecting topographical features of microe...
- Patent number 6,779,386
- Issue date Aug 24, 2004
- Micron Technology Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
- Publication number 20230378209
- Publication date Nov 23, 2023
- Semiconductor Components Industries, LLC
- Chee Peng NEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE IN DIE BGA PACKAGE
- Publication number 20130154117
- Publication date Jun 20, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICON...
- Publication number 20110287581
- Publication date Nov 24, 2011
- Micron Technology, Inc.
- Chee Peng Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICON...
- Publication number 20080261383
- Publication date Oct 23, 2008
- Micron Technology, Inc.
- Chee Peng Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20080136045
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die in Die BGA Package
- Publication number 20080096316
- Publication date Apr 24, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die in Die BGA Package
- Publication number 20080032449
- Publication date Feb 7, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292746
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292743
- Publication date Dec 28, 2006
- Micron Technolgoy, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292745
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060216864
- Publication date Sep 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for detecting topographical features of microe...
- Publication number 20050229684
- Publication date Oct 20, 2005
- Micron Technology, Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for detecting topographical features of microe...
- Publication number 20040253748
- Publication date Dec 16, 2004
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Application
Stacked die in die BGA package
- Publication number 20030207516
- Publication date Nov 6, 2003
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030207515
- Publication date Nov 6, 2003
- Micron Technology, Inc., Boise, ID
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030162325
- Publication date Aug 28, 2003
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030148597
- Publication date Aug 7, 2003
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for detecting topographical features of microe...
- Publication number 20030041656
- Publication date Mar 6, 2003
- Chee Peng Neo
- G01 - MEASURING TESTING

Chee Peng Neo

Person

Patents Grantslast 30 patents

Semiconductor workpiece carriers and methods for processing semicon...

Stacked die in die BGA package

Semiconductor workpiece carriers and methods for processing semicon...

Method of fabricating a stacked die having a recess in a die BGA pa...

Method of fabricating microelectronic component assemblies employin...

Stacked die with a recess in a die BGA package

Method of fabricating a stacked die having a recess in a die BGA pa...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die-in-die BGA package with die having a recess

Method of fabricating a stacked die in die BGA package

Method and apparatus for detecting topographical features of microe...

Method and apparatus for detecting topographical features of microe...

Method and apparatus for detecting topographical features of microe...

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS

STACKED DIE IN DIE BGA PACKAGE

SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICON...

SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICON...

Stacked die in die BGA package

Stacked Die in Die BGA Package

Stacked Die in Die BGA Package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method and apparatus for detecting topographical features of microe...

Method and apparatus for detecting topographical features of microe...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method and apparatus for detecting topographical features of microe...