Chee Seng LEONG

Person

Wilayah Persekutuan, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Fabric die to fabric die interconnect for modularized integrated ci...
- Patent number 12,009,298
- Issue date Jun 11, 2024
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric die to fabric die interconnect for modularized integrated ci...
- Patent number 11,670,589
- Issue date Jun 6, 2023
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable delay circuits and methods
- Patent number 11,043,942
- Issue date Jun 22, 2021
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fabric die to fabric die interconnect for modularized integrated ci...
- Patent number 10,886,218
- Issue date Jan 5, 2021
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible transmitter circuitry for integrated circuits
- Patent number 10,848,155
- Issue date Nov 24, 2020
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Low power clamp for electrical overstress protection
- Patent number 10,333,504
- Issue date Jun 25, 2019
- Intel Corporation
- Amit Kumar Srivastava
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High resolution and low power interpolator for delay chain
- Patent number 10,200,046
- Issue date Feb 5, 2019
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Apparatus for high voltage tolerant driver
- Patent number 9,813,064
- Issue date Nov 7, 2017
- Intel Corporation
- Chia How Low
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20240312909
- Publication date Sep 19, 2024
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20230378061
- Publication date Nov 23, 2023
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD AND SYSTEM TO DETERMINE CALIBRATION INFORMATION WITH...
- Publication number 20230088853
- Publication date Mar 23, 2023
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20210111116
- Publication date Apr 15, 2021
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20190326210
- Publication date Oct 24, 2019
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRANSMITTER CIRCUITRY FOR INTEGRATED CIRCUITS
- Publication number 20190181865
- Publication date Jun 13, 2019
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Variable Delay Circuits And Methods
- Publication number 20190123727
- Publication date Apr 25, 2019
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW POWER CLAMP FOR ELECTRICAL OVERSTRESS PROTECTION
- Publication number 20160233854
- Publication date Aug 11, 2016
- Intel Corporation
- Amit Kumar SRIVASTAVA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPARATUS FOR HIGH VOLTAGE TOLERANT DRIVER
- Publication number 20150171830
- Publication date Jun 18, 2015
- Chia How LOW
- H03 - BASIC ELECTRONIC CIRCUITRY

Chee Seng LEONG

Person

Patents Grantslast 30 patents

Fabric die to fabric die interconnect for modularized integrated ci...

Fabric die to fabric die interconnect for modularized integrated ci...

Variable delay circuits and methods

Fabric die to fabric die interconnect for modularized integrated ci...

Flexible transmitter circuitry for integrated circuits

Low power clamp for electrical overstress protection

High resolution and low power interpolator for delay chain

Apparatus for high voltage tolerant driver

Patents Applicationslast 30 patents

Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...

Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...

DEVICE, METHOD AND SYSTEM TO DETERMINE CALIBRATION INFORMATION WITH...

Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...

Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...

FLEXIBLE TRANSMITTER CIRCUITRY FOR INTEGRATED CIRCUITS

Variable Delay Circuits And Methods

LOW POWER CLAMP FOR ELECTRICAL OVERSTRESS PROTECTION

APPARATUS FOR HIGH VOLTAGE TOLERANT DRIVER