Chee Seng ong

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 9,875,973
- Issue date Jan 23, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 9,520,365
- Issue date Dec 13, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device carrier for fine pitch packaging miniaturizati...
- Patent number 9,396,982
- Issue date Jul 19, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and manufacturing method thereof
- Patent number 9,362,206
- Issue date Jun 7, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element for package miniaturization
- Patent number 9,287,157
- Issue date Mar 15, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections for fine pitch semiconductor devices and manufactu...
- Patent number 8,846,519
- Issue date Sep 30, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,796,844
- Issue date Aug 5, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 8,766,438
- Issue date Jul 1, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 8,492,203
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape storage slot
- Patent number 8,379,343
- Issue date Feb 19, 2013
- Venture Corporation Limited
- Heng Kuang Cheng
- G11 - INFORMATION STORAGE
Information Patent Grant
Tape cartridge tray transmission device apparatus with rack and pin...
- Patent number 8,320,071
- Issue date Nov 27, 2012
- Venture Corporation Limited
- Kar Woh Fok
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnections for fine pitch semiconductor devices and manufactu...
- Patent number 8,207,608
- Issue date Jun 26, 2012
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overall system design and layout of an on-demand label/tag printer...
- Patent number 6,921,222
- Issue date Jul 26, 2005
- Venture Manufacturing (Singapore) Ltd.
- Keng Leong Ng
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160329306
- Publication date Nov 10, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20160268225
- Publication date Sep 15, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20140299984
- Publication date Oct 9, 2014
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION APPARATUS
- Publication number 20140030050
- Publication date Jan 30, 2014
- Venture Corporation Limited
- Wai Kean Chan
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20130241048
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20130140719
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20120220118
- Publication date Aug 30, 2012
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20120187584
- Publication date Jul 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20120153466
- Publication date Jun 21, 2012
- Hwee-Seng Jimmy Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION APPARATUS FOR A TAPE LIBRARY
- Publication number 20110000326
- Publication date Jan 6, 2011
- Venture Corporation Limited
- Kar Woh Fok
- G11 - INFORMATION STORAGE
Information Patent Application
Tape Storage Slot
- Publication number 20110000863
- Publication date Jan 6, 2011
- Venture Corporation Limited
- Heng Kuang Cheng
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF CLEANING A SEMICONDUCTOR SUBSTRATE
- Publication number 20090042388
- Publication date Feb 12, 2009
- Zhi-Qiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BONDING PROCESS FOR CHIP PACKAGING
- Publication number 20080248610
- Publication date Oct 9, 2008
- Advanpack Solutions Pte Ltd
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20080145967
- Publication date Jun 19, 2008
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip and manufacturing method thereof
- Publication number 20080088013
- Publication date Apr 17, 2008
- ADVANPACK SOLUTONS PTE LTD.
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Overall system design and layout of an on-demand label/tag printer...
- Publication number 20040156665
- Publication date Aug 12, 2004
- VENTURE MANUFACTURING (SINGAPORE) LTD.
- Keng Leong Ng
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Chee Seng ong

Person

Patents Grantslast 30 patents

Semiconductor device and method for forming semiconductor package h...

Semiconductor device and method for forming semiconductor package h...

Semiconductor device carrier for fine pitch packaging miniaturizati...

Chip and manufacturing method thereof

Semiconductor element for package miniaturization

Method for device packaging

Interconnections for fine pitch semiconductor devices and manufactu...

Package structure

Package structure

Semiconductor device and method for forming semiconductor package h...

Tape storage slot

Tape cartridge tray transmission device apparatus with rack and pin...

Interconnections for fine pitch semiconductor devices and manufactu...

Overall system design and layout of an on-demand label/tag printer...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP AND MANUFACTURING METHOD THEREOF

CHIP AND MANUFACTURING METHOD THEREOF

TRANSMISSION APPARATUS

Semiconductor Device and Method for Forming Semiconductor Package H...

Semiconductor Device and Method for Forming Semiconductor Package H...

CHIP AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method for Forming Semiconductor Package H...

PACKAGE STRUCTURE

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

TRANSMISSION APPARATUS FOR A TAPE LIBRARY

Tape Storage Slot

METHOD OF CLEANING A SEMICONDUCTOR SUBSTRATE

THERMAL BONDING PROCESS FOR CHIP PACKAGING

Semiconductor package and manufacturing method thereof

Chip and manufacturing method thereof

Overall system design and layout of an on-demand label/tag printer...