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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Module comprising a semiconductor chip
Patent number
9,379,046
Issue date
Jun 28, 2016
Infineon Technologies AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Module comprising a semiconductor chip
Patent number
9,123,526
Issue date
Sep 1, 2015
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module comprising a semiconductor chip
Patent number
8,633,102
Issue date
Jan 21, 2014
Infineon Technologies AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Module comprising a semiconductor chip
Patent number
8,237,268
Issue date
Aug 7, 2012
Infineon Technologies AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor package with ribbon with metal layers
Patent number
8,022,558
Issue date
Sep 20, 2011
Infineon Technologies AG
Chee Soon Law
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Module Comprising a Semiconductor Chip
Publication number
20150294926
Publication date
Oct 15, 2015
INFINEON TECHNOLOGIES AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Module Comprising a Semiconductor Chip
Publication number
20140110829
Publication date
Apr 24, 2014
INFINEON TECHNOLOGIES AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Module Comprising a Semiconductor Chip
Publication number
20120276693
Publication date
Nov 1, 2012
INFINEON TECHNOLOGIES AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH RIBBON WITH METAL LAYERS
Publication number
20100207279
Publication date
Aug 19, 2010
INFINEON TECHNOLOGIES AG
Chee Soon Law
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module comprising a semiconductor chip
Publication number
20080230928
Publication date
Sep 25, 2008
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY