Chee Voon Tan

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lead tip inspection feature
- Patent number 11,587,800
- Issue date Feb 21, 2023
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooled molded semiconductor package
- Patent number 11,302,613
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package and method for fabricating a power semi...
- Patent number 11,211,356
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with double-sided cooling
- Patent number 10,886,199
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having contact pins at short side edges
- Patent number 10,037,934
- Issue date Jul 31, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of formation thereof
- Patent number 9,478,484
- Issue date Oct 25, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple chips mounted to a carrier
- Patent number 9,263,421
- Issue date Feb 16, 2016
- Infineon Technologies AG
- Boon Seong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic array and chip package
- Patent number 9,111,772
- Issue date Aug 18, 2015
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protruding component portion and method o...
- Patent number 8,664,753
- Issue date Mar 4, 2014
- Infineon Technologies AG
- Teck Sim Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...
- Publication number 20240006260
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Chee Hong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...
- Publication number 20230282553
- Publication date Sep 7, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...
- Publication number 20230230903
- Publication date Jul 20, 2023
- INFINEON TECHNOLOGIES AG
- Hooi Boon TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Lead Tip Inspection Feature
- Publication number 20230049564
- Publication date Feb 16, 2023
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSE...
- Publication number 20220406692
- Publication date Dec 22, 2022
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Lead Tip Inspection Feature
- Publication number 20210366732
- Publication date Nov 25, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package and Method for Fabricating a Power Semi...
- Publication number 20210057375
- Publication date Feb 25, 2021
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with Double-Sided Cooling
- Publication number 20210020547
- Publication date Jan 21, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Cooled Molded Semiconductor Package
- Publication number 20210020550
- Publication date Jan 21, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273790
- Publication date Aug 27, 2020
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Contact Pins at Short Side Edges
- Publication number 20160233149
- Publication date Aug 11, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Multiple Chips Mounted to a Carrier
- Publication number 20150249067
- Publication date Sep 3, 2015
- INFINEON TECHNOLOGIES AG
- Boon Seong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ARRAY AND CHIP PACKAGE
- Publication number 20150214297
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Formation Thereof
- Publication number 20140110828
- Publication date Apr 24, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD O...
- Publication number 20110121439
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Teck Sim Lee
- H01 - BASIC ELECTRIC ELEMENTS

Chee Voon Tan

Person

Patents Grantslast 30 patents

Power semiconductor module for PCB embedding, power electronic asse...

Semiconductor package with lead tip inspection feature

Clip frame assembly, semiconductor package having a lead frame and...

Double-sided cooled molded semiconductor package

Power semiconductor package and method for fabricating a power semi...

Molded semiconductor package with double-sided cooling

Semiconductor chip package having contact pins at short side edges

Semiconductor packages and methods of formation thereof

Semiconductor device having multiple chips mounted to a carrier

Electronic array and chip package

Semiconductor device with protruding component portion and method o...

Patents Applicationslast 30 patents

ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...

POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...

SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

Semiconductor Package with Lead Tip Inspection Feature

POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSE...

Semiconductor Package with Lead Tip Inspection Feature

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Power Semiconductor Package and Method for Fabricating a Power Semi...

Molded Semiconductor Package with Double-Sided Cooling

Double-Sided Cooled Molded Semiconductor Package

Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...

Semiconductor Chip Package Having Contact Pins at Short Side Edges

Semiconductor Device Having Multiple Chips Mounted to a Carrier

ELECTRONIC ARRAY AND CHIP PACKAGE

Semiconductor Packages and Methods of Formation Thereof

SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD O...