Chee-Way Oh

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
High frequency flip chip package structure of polymer substrate
- Patent number 8,258,606
- Issue date Sep 4, 2012
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency flip chip package process of polymer substrate and s...
- Patent number 8,033,039
- Issue date Oct 11, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
- Publication number 20110186974
- Publication date Aug 4, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS