Chee Yang Ng

Person

Muar, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Dipped coated electronic module assembly with enhanced thermal dist...
- Patent number 12,232,302
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor chip package with source coupling
- Patent number 12,094,807
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded package
- Patent number 11,521,907
- Issue date Dec 6, 2022
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with conductive frame for I/O standoff and t...
- Patent number 11,393,743
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Stuart Cardwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 11,174,152
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with acoustic sensing device(s) and millimeter wave sensing...
- Patent number 11,039,231
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Kok Yau Chua
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Semiconductor package having a filled conductive cavity
- Patent number 10,770,399
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a through port for sensor applications
- Patent number 10,549,985
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 10,501,312
- Issue date Dec 10, 2019
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device having substrate with conductive pillars
- Patent number 10,304,780
- Issue date May 28, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap
- Patent number 10,224,260
- Issue date Mar 5, 2019
- Infineon Technologies AG
- Chee Yang Ng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device having substrate with conductive pillars
- Patent number 10,163,812
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with electrically conducting layer
- Patent number 10,109,592
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded cavity package with embedded conductive layer and enhanced s...
- Patent number 9,868,632
- Issue date Jan 16, 2018
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and a method for forming a semiconductor device
- Patent number 9,628,918
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Chee Yang Ng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated passives package, semiconductor module and method of man...
- Patent number 9,117,807
- Issue date Aug 25, 2015
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package with Vertical Electronic Components Held Together by a Clip
- Publication number 20250062273
- Publication date Feb 20, 2025
- Infineon Technologies Austria AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
- Publication number 20250054831
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH INDUCTOR-COOLED POWER STAGE
- Publication number 20250048531
- Publication date Feb 6, 2025
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...
- Publication number 20250022768
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPED COATED ELECTRONIC MODULE ASSEMBLY WITH ENHANCED THERMAL DIST...
- Publication number 20240215208
- Publication date Jun 27, 2024
- Infineon Technologies Austria AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LATERAL POWER TRANSISTOR
- Publication number 20240162136
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE
- Publication number 20230371165
- Publication date Nov 16, 2023
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PACKAGE BY SOLDERABLE OR SINTERABLE METALLIC CONNECTI...
- Publication number 20230335516
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Embedded Package
- Publication number 20230052437
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...
- Publication number 20230027669
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Chip Package, Method of Forming a Semiconductor...
- Publication number 20220139798
- Publication date May 5, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
- Publication number 20220122906
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Sergey YUFEREV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Embedded Package
- Publication number 20220115287
- Publication date Apr 14, 2022
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
- Publication number 20220102263
- Publication date Mar 31, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly with Conductive Frame for I/O Standoff and T...
- Publication number 20210193560
- Publication date Jun 24, 2021
- INFINEON TECHNOLOGIES AG
- Stuart Cardwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Filled Conductive Cavity
- Publication number 20200258842
- Publication date Aug 13, 2020
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING...
- Publication number 20200154183
- Publication date May 14, 2020
- INFINEON TECHNOLOGIES AG
- Kok Yau Chua
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
- Publication number 20200048075
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING
- Publication number 20190023561
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
- Publication number 20180308804
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
- Publication number 20180148322
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
- Publication number 20180108616
- Publication date Apr 19, 2018
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Cavity Package with Embedded Conductive Layer and Enhanced S...
- Publication number 20170275159
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20150146894
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Chip with Electrically Conducting Layer
- Publication number 20150145107
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Air Gap
- Publication number 20150145078
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Passives Package, Semiconductor Module and Method of Man...
- Publication number 20150028463
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS

Chee Yang Ng

Person

Patents Grantslast 30 patents

Dipped coated electronic module assembly with enhanced thermal dist...

Voltage regulator module with inductor-cooled power stage

Method of forming a chip package, method of forming a semiconductor...

Stacked transistor chip package with source coupling

Semiconductor package having a chip carrier with a pad offset feature

Semiconductor package having a chip carrier and a metal plate sized...

Hybrid embedded package

Semiconductor assembly with conductive frame for I/O standoff and t...

Semiconductor package having a laser-activatable mold compound

Over-under sensor packaging with sensor spaced apart from control chip

Package with acoustic sensing device(s) and millimeter wave sensing...

Semiconductor package having a filled conductive cavity

Semiconductor package with a through port for sensor applications

Over-under sensor packaging with sensor spaced apart from control chip

Device having substrate with conductive pillars

Semiconductor package with air gap

Device having substrate with conductive pillars

Semiconductor chip with electrically conducting layer

Molded cavity package with embedded conductive layer and enhanced s...

Semiconductor device and a method for forming a semiconductor device

Integrated passives package, semiconductor module and method of man...

Patents Applicationslast 30 patents

Package with Vertical Electronic Components Held Together by a Clip

METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...

POWER MODULE WITH INDUCTOR-COOLED POWER STAGE

METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

DIPPED COATED ELECTRONIC MODULE ASSEMBLY WITH ENHANCED THERMAL DIST...

PACKAGE FOR A LATERAL POWER TRANSISTOR

VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE

MANUFACTURING PACKAGE BY SOLDERABLE OR SINTERABLE METALLIC CONNECTI...

Hybrid Embedded Package

ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...

Method of Forming a Chip Package, Method of Forming a Semiconductor...

STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING

Hybrid Embedded Package

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

Semiconductor Assembly with Conductive Frame for I/O Standoff and T...

Semiconductor Package Having a Laser-Activatable Mold Compound

Semiconductor Package Having a Filled Conductive Cavity

PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING...

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING

DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS

Semiconductor Package with a Through Port for Sensor Applications a...

DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS

Molded Cavity Package with Embedded Conductive Layer and Enhanced S...

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

Semiconductor Chip with Electrically Conducting Layer

Semiconductor Package with Air Gap

Integrated Passives Package, Semiconductor Module and Method of Man...