Chee-Yee Chung

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Resistive element apparatus and method
- Patent number 7,239,524
- Issue date Jul 3, 2007
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitors having separate terminals on three or more sides
- Patent number 7,176,565
- Issue date Feb 13, 2007
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stiffener
- Patent number 7,173,329
- Issue date Feb 6, 2007
- Intel Corporation
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with sandwiched capacitors
- Patent number 7,133,294
- Issue date Nov 7, 2006
- Intel Corporation
- Priyavadan R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual referenced microstrip
- Patent number 7,109,569
- Issue date Sep 19, 2006
- Intel Corporation
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery system having a plurality of stages and method for s...
- Patent number 6,946,824
- Issue date Sep 20, 2005
- Intel Corporation
- Alex Waizman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assembly with sandwiched capacitors and methods of manuf...
- Patent number 6,900,991
- Issue date May 31, 2005
- Intel Corporation
- Priyavadan R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication for a socket with embedded conductive structure
- Patent number 6,877,223
- Issue date Apr 12, 2005
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly with vertical multiple layer structure
- Patent number 6,717,277
- Issue date Apr 6, 2004
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual referenced microstrip
- Patent number 6,686,819
- Issue date Feb 3, 2004
- Intel Corporation
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for vertical electronic circuit package and system
- Patent number 6,680,218
- Issue date Jan 20, 2004
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad and via placement design for land side capacitors
- Patent number 6,657,275
- Issue date Dec 2, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with laterally connected capacitors and manufac...
- Patent number 6,636,416
- Issue date Oct 21, 2003
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for package socket with embedded power and ground...
- Patent number 6,584,685
- Issue date Jul 1, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded enclosure for effective electromagnetic radiation reduction
- Patent number 6,559,484
- Issue date May 6, 2003
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for package socket with embedded power and ground...
- Patent number 6,558,181
- Issue date May 6, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical electronic circuit package
- Patent number 6,555,920
- Issue date Apr 29, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integral capacitor using embedded enclosure for effective electroma...
- Patent number 6,509,640
- Issue date Jan 21, 2003
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket with embedded conductive structure and method of fabrication...
- Patent number 6,428,358
- Issue date Aug 6, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method
- Patent number 6,392,301
- Issue date May 21, 2002
- Intel Corporation
- Alex Waizman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced plated-through hole and via contact design
- Patent number 6,362,438
- Issue date Mar 26, 2002
- Intel Corporation
- Tee Onn Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded capacitor assembly in a package
- Patent number 6,346,743
- Issue date Feb 12, 2002
- Intel Corp.
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STIFFENER
- Publication number 20070120149
- Publication date May 31, 2007
- Intel Corporation
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR HAVING SEPARATE TERMINALS ON THREE OR MORE SIDES AND METH...
- Publication number 20060256502
- Publication date Nov 16, 2006
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages with sandwiched capacitors
- Publication number 20050156280
- Publication date Jul 21, 2005
- Intel Corporation
- P. R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting capacitors under ball grid array
- Publication number 20040125580
- Publication date Jul 1, 2004
- Intel Corporation
- Chee Yee Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Dual referenced microstrip
- Publication number 20040061577
- Publication date Apr 1, 2004
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical assembly with vertical multiple layer structure
- Publication number 20030151147
- Publication date Aug 14, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical electronic circuit package and method of fabrication therefor
- Publication number 20030151146
- Publication date Aug 14, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual referenced microstrip
- Publication number 20030146811
- Publication date Aug 7, 2003
- James Breisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with sandwiched capacitors and methods of manuf...
- Publication number 20030102555
- Publication date Jun 5, 2003
- Intel Corporation
- P. R. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor having separate terminals on three or more sides and meth...
- Publication number 20030102523
- Publication date Jun 5, 2003
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resistive element apparatus and method
- Publication number 20030072140
- Publication date Apr 17, 2003
- Intel Corporation
- Chee-Yee Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Arrangements to supply power to semiconductor package
- Publication number 20030062602
- Publication date Apr 3, 2003
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power delivery system and method for setting power delivery system...
- Publication number 20030046594
- Publication date Mar 6, 2003
- Alex Waizman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Vertical electronic circuit package and method of fabrication therefor
- Publication number 20030003705
- Publication date Jan 2, 2003
- Intel Corporation
- Chee-Yee Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabrication for a socket with embedded conductive structure
- Publication number 20020151218
- Publication date Oct 17, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for pakage socket with embedded power and ground...
- Publication number 20020115330
- Publication date Aug 22, 2002
- Chee-Yee Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
System and method for package socket with embedded power and ground...
- Publication number 20020115313
- Publication date Aug 22, 2002
- Chee-Yee Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SOCKET WITH EMBEDDED CONDUCTIVE STRUCTURE
- Publication number 20020086568
- Publication date Jul 4, 2002
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Chee-Yee Chung

Person

Patents Grantslast 30 patents

Resistive element apparatus and method

Capacitors having separate terminals on three or more sides

Package stiffener

Integrated circuit packages with sandwiched capacitors

Dual referenced microstrip

Power delivery system having a plurality of stages and method for s...

Electronic assembly with sandwiched capacitors and methods of manuf...

Method of fabrication for a socket with embedded conductive structure

Electrical assembly with vertical multiple layer structure

Dual referenced microstrip

Fabrication method for vertical electronic circuit package and system

Pad and via placement design for land side capacitors

Electronic assembly with laterally connected capacitors and manufac...

System and method for package socket with embedded power and ground...

Embedded enclosure for effective electromagnetic radiation reduction

System and method for package socket with embedded power and ground...

Vertical electronic circuit package

Integral capacitor using embedded enclosure for effective electroma...

Socket with embedded conductive structure and method of fabrication...

Chip package and method

Enhanced plated-through hole and via contact design

Embedded capacitor assembly in a package

Patents Applicationslast 30 patents

PACKAGE STIFFENER

CAPACITOR HAVING SEPARATE TERMINALS ON THREE OR MORE SIDES AND METH...

Integrated circuit packages with sandwiched capacitors

Mounting capacitors under ball grid array

Dual referenced microstrip

Electrical assembly with vertical multiple layer structure

Vertical electronic circuit package and method of fabrication therefor

Dual referenced microstrip

Electronic assembly with sandwiched capacitors and methods of manuf...

Capacitor having separate terminals on three or more sides and meth...

Resistive element apparatus and method

Arrangements to supply power to semiconductor package

Power delivery system and method for setting power delivery system...

Vertical electronic circuit package and method of fabrication therefor

Method of fabrication for a socket with embedded conductive structure

System and method for pakage socket with embedded power and ground...

System and method for package socket with embedded power and ground...

SOCKET WITH EMBEDDED CONDUCTIVE STRUCTURE