Cheeman Yu

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Discrete component backward traceability and semiconductor device f...
- Patent number 10,229,886
- Issue date Mar 12, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with coextensive electrical connectors and co...
- Patent number 10,051,733
- Issue date Aug 14, 2018
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire tail connector for a semiconductor device
- Patent number 9,362,244
- Issue date Jun 7, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding and thermal dissipation for semiconductor device
- Patent number 9,337,153
- Issue date May 10, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die laminating device with independent drives
- Patent number 9,331,045
- Issue date May 3, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield semiconductor device
- Patent number 9,240,393
- Issue date Jan 19, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including embedded controller die and method o...
- Patent number 9,236,368
- Issue date Jan 12, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 9,230,919
- Issue date Jan 5, 2016
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hidden plating traces
- Patent number 9,209,159
- Issue date Dec 8, 2015
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 8,878,368
- Issue date Nov 4, 2014
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die stack arrangement including staggered...
- Patent number 8,853,863
- Issue date Oct 7, 2014
- SanDisk Technologies Inc.
- Chin-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density three dimensional semiconductor die package
- Patent number 8,653,653
- Issue date Feb 18, 2014
- SanDisk Technologies Inc.
- Cheeman Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Corrugated die edge for stacked die semiconductor package
- Patent number 8,502,375
- Issue date Aug 6, 2013
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between transfer molded IC packages a...
- Patent number 8,482,139
- Issue date Jul 9, 2013
- SanDisk Technologies Inc.
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with die stack arrangement including staggered...
- Patent number 8,415,808
- Issue date Apr 9, 2013
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a two-sided die in a four-sided leadframe bas...
- Patent number 8,349,655
- Issue date Jan 8, 2013
- SanDisk Technologies Inc.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between transfer molded IC packages a...
- Patent number 8,232,145
- Issue date Jul 31, 2012
- SanDisk Technologies Inc.
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board with coextensive electrical connectors and co...
- Patent number 8,217,522
- Issue date Jul 10, 2012
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hidden plating traces
- Patent number 8,129,272
- Issue date Mar 6, 2012
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stacking and interconnecting semiconductor packages via e...
- Patent number 8,110,439
- Issue date Feb 7, 2012
- SanDisk Technologies Inc.
- Cheeman Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of stacking and interconnecting semiconductor packages via e...
- Patent number 8,053,276
- Issue date Nov 8, 2011
- SanDisk Technologies, Inc
- Cheeman Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked, interconnected semiconductor package
- Patent number 8,053,880
- Issue date Nov 8, 2011
- SanDisk Technologies, Inc
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having a redistribution layer
- Patent number 7,939,944
- Issue date May 10, 2011
- SanDisk Corporation
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE F...
- Publication number 20160181205
- Publication date Jun 23, 2016
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...
- Publication number 20160086827
- Publication date Mar 24, 2016
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CO...
- Publication number 20150223335
- Publication date Aug 6, 2015
- SANDISK TECHNOLOGIES INC.
- Chih-Chin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CONTROLLER DIE AND METHOD O...
- Publication number 20150214206
- Publication date Jul 30, 2015
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES
- Publication number 20150115479
- Publication date Apr 30, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH YIELD SEMICONDUCTOR DEVICE
- Publication number 20150061157
- Publication date Mar 5, 2015
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20150054177
- Publication date Feb 26, 2015
- SANDISK TECHNOLOGIES INC.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE TAIL CONNECTOR FOR A SEMICONDUCTOR DEVICE
- Publication number 20150001739
- Publication date Jan 1, 2015
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...
- Publication number 20140346686
- Publication date Nov 27, 2014
- Fu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDING AND THERMAL DISSIPATION FOR SEMICONDUCTOR DEVICE
- Publication number 20140015116
- Publication date Jan 16, 2014
- Sandisk Information Technology (Shanghai) Co.,
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20130299959
- Publication date Nov 14, 2013
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED...
- Publication number 20130207280
- Publication date Aug 15, 2013
- SANDISK TECHNOLOGIES INC.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
- Publication number 20130015589
- Publication date Jan 17, 2013
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE F...
- Publication number 20130006564
- Publication date Jan 3, 2013
- Didier Chavet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIDDEN PLATING TRACES
- Publication number 20120164828
- Publication date Jun 28, 2012
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-TREATMENT OF MEMORY CARDS FOR BINDING GLUE AND OTHER CURABLE FL...
- Publication number 20120146247
- Publication date Jun 14, 2012
- Itzhak Pomerantz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRE-TREATMENT OF MEMORY CARDS FOR INK JET PRINTING
- Publication number 20120081860
- Publication date Apr 5, 2012
- Itzhak Pomerantz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED...
- Publication number 20120025396
- Publication date Feb 2, 2012
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRUGATED DIE EDGE FOR STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20110316164
- Publication date Dec 29, 2011
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board With Coextensive Electrical Connectors And Co...
- Publication number 20100252315
- Publication date Oct 7, 2010
- Chih-Chin Liao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...
- Publication number 20100052155
- Publication date Mar 4, 2010
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF STACKING AND INTERCONNECTING SEMICONDUCTOR PACKAGES VIA E...
- Publication number 20100055836
- Publication date Mar 4, 2010
- Cheeman Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...
- Publication number 20100055847
- Publication date Mar 4, 2010
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Person

Patents Grantslast 30 patents

Discrete component backward traceability and semiconductor device f...

Printed circuit board with coextensive electrical connectors and co...

Semiconductor device including independent film layer for embedding...

Waterfall wire bonding

Wire tail connector for a semiconductor device

EMI shielding and thermal dissipation for semiconductor device

Semiconductor die laminating device with independent drives

High yield semiconductor device

Semiconductor device including embedded controller die and method o...

Rigid wave pattern design on chip carrier substrate and printed cir...

Hidden plating traces

Rigid wave pattern design on chip carrier substrate and printed cir...

Semiconductor device with die stack arrangement including staggered...

High density three dimensional semiconductor die package

Corrugated die edge for stacked die semiconductor package

Methods of promoting adhesion between transfer molded IC packages a...

Semiconductor device with die stack arrangement including staggered...

Method of fabricating a two-sided die in a four-sided leadframe bas...

Methods of promoting adhesion between transfer molded IC packages a...

Printed circuit board with coextensive electrical connectors and co...

Hidden plating traces

Method of stacking and interconnecting semiconductor packages via e...

Method of stacking and interconnecting semiconductor packages via e...

Stacked, interconnected semiconductor package

Semiconductor die having a redistribution layer

Patents Applicationslast 30 patents

DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE F...

METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...

SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...

PRINTED CIRCUIT BOARD WITH COEXTENSIVE ELECTRICAL CONNECTORS AND CO...

SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CONTROLLER DIE AND METHOD O...

SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES

HIGH YIELD SEMICONDUCTOR DEVICE

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

WIRE TAIL CONNECTOR FOR A SEMICONDUCTOR DEVICE

METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...

WATERFALL WIRE BONDING

EMI SHIELDING AND THERMAL DISSIPATION FOR SEMICONDUCTOR DEVICE

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED...

CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS

DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE F...

HIDDEN PLATING TRACES

PRE-TREATMENT OF MEMORY CARDS FOR BINDING GLUE AND OTHER CURABLE FL...

PRE-TREATMENT OF MEMORY CARDS FOR INK JET PRINTING

SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED...

CORRUGATED DIE EDGE FOR STACKED DIE SEMICONDUCTOR PACKAGE

Printed Circuit Board With Coextensive Electrical Connectors And Co...

METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...

METHOD OF STACKING AND INTERCONNECTING SEMICONDUCTOR PACKAGES VIA E...

METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...