Chen-Che CHIN

Follow

Person

Tao Yuan Shien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method for dicing of semiconductor wafers using laser c...
- Patent number 9,287,175
- Issue date Mar 15, 2016
- Win Semiconductors Corp.
- Chang-Huang Hua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER C...
- Publication number 20140120699
- Publication date May 1, 2014
- WIN SEMICONDUCTORS CORP.
- Chang-Huang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER C...
- Publication number 20120115308
- Publication date May 10, 2012
- Chang-Huang HUA
- H01 - BASIC ELECTRIC ELEMENTS