Chen-Chih Tsai

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Naperville, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical planarization pads via vat-based production
- Patent number 11,845,157
- Issue date Dec 19, 2023
- CMC Materials, Inc.
- Eric S. Moyer
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad employing polyamine and cyclohexanedimethanol curatives
- Patent number 11,845,156
- Issue date Dec 19, 2023
- CMC Materials, Inc.
- Rui Ma
- B24 - GRINDING POLISHING
Information Patent Grant
UV-curable resins used for chemical mechanical polishing pads
- Patent number 11,807,710
- Issue date Nov 7, 2023
- CMC Materials, Inc.
- Chen-Chih Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Polyurethane CMP pads having a high modulus ratio
- Patent number 10,562,149
- Issue date Feb 18, 2020
- Cabot Microelectronics Corporation
- Lin Fu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS
- Publication number 20230405765
- Publication date Dec 21, 2023
- CMC Materials LLC
- Chen-Chih TSAI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SUBPAD HAVING POROGENS WITH POLYMERIC...
- Publication number 20220193860
- Publication date Jun 23, 2022
- CMC Materials, Inc.
- Dustin MILLER
- B24 - GRINDING POLISHING
Information Patent Application
UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS
- Publication number 20220119586
- Publication date Apr 21, 2022
- CMC Materials, Inc.
- Chen-Chih TSAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLISHING PAD EMPLOYING POLYAMINE AND CYCLOHEXANEDIMETHANOL CURATIVES
- Publication number 20210008687
- Publication date Jan 14, 2021
- Cabot Microelectronics Corporation
- Rui MA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION PADS VIA VAT-BASED PRODUCTION
- Publication number 20200353586
- Publication date Nov 12, 2020
- Cabot Microelectronics Corporation
- Eric S. MOYER
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO
- Publication number 20170087688
- Publication date Mar 30, 2017
- Cabot Microelectronics Corporation
- Lin FU
- B24 - GRINDING POLISHING