Chen-En Yen

Person

Changhua County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,040,256
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,944
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pad
- Patent number 11,942,445
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,776,881
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,742,204
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,569,419
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,289,404
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer etching process and methods thereof
- Patent number 11,177,137
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,101,233
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,004,685
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 10,651,142
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 10,283,471
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240321691
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234637
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240021499
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20230369049
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170443
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220216133
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220140197
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE PAD
- Publication number 20210384152
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20210265165
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210225735
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ETCHING PROCESS AND METHODS THEREOF
- Publication number 20210225658
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273827
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STRUCTURES AND METHODS OF FORMING
- Publication number 20200176254
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190259719
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139917
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Chen-En Yen

Person

Patents Grantslast 30 patents

Semiconductor device and method

Semiconductor device and manufacturing method thereof

Semiconductor device with conductive pad

Semiconductor device and method

Multi-layer structures and methods of forming

Semiconductor device and manufacturing method thereof

Semiconductor device and method

Wafer etching process and methods thereof

Micro-connection structure and manufacturing method thereof

Semiconductor device and method for forming the same

Multi-layer structures and methods of forming

Micro-connection structure and manufacturing method thereof

Micro-connection structure and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

Multi-Layer Structures and Methods of Forming

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH CONDUCTIVE PAD

Multi-Layer Structures and Methods of Forming

Semiconductor Device and Method

WAFER ETCHING PROCESS AND METHODS THEREOF

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER STRUCTURES AND METHODS OF FORMING

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF