Chen-Fa Tsai

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Irregular mechanical motion detection systems and method
- Patent number 12,172,262
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chunhung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,142,579
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and isolation techniques for stacked transistor structures
- Patent number 12,132,079
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor device having a barrier layer wit...
- Patent number 12,100,756
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Hao-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 12,087,592
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a nano-FET semiconductor device
- Patent number 12,040,382
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device having dummy micro bumps...
- Patent number 12,020,952
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation for semiconductor devices and methods of manufacture
- Patent number 11,990,404
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 11,908,708
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 11,901,189
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement method and non-transitory computer readable storage medium
- Patent number 11,861,283
- Issue date Jan 2, 2024
- Global Unichip Corporation
- Chen-Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,984
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 11,855,040
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display panel
- Patent number 11,850,833
- Issue date Dec 26, 2023
- E Ink Holdings Inc.
- Yi-Sheng Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Package structure with underfill
- Patent number 11,817,425
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,769,739
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Irregular mechanical motion detection systems and method
- Patent number 11,731,232
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chunhung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated circuits having protruding interconnect conductors
- Patent number 11,728,397
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,703,738
- Issue date Jul 18, 2023
- E Ink Holdings Inc.
- Hsing-Kai Wang
- G02 - OPTICS
Information Patent Grant
Display apparatus and driving method thereof
- Patent number 11,663,987
- Issue date May 30, 2023
- E Ink Holdings Inc.
- Yi-Sheng Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 11,585,008
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for wafer pre-wetting
- Patent number 11,585,005
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silicide backside contact
- Patent number 11,569,364
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact features in semiconductor devices
- Patent number 11,532,480
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device package including conformal m...
- Patent number 11,488,842
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,355,454
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impact resistant structure and electronic device
- Patent number 11,262,482
- Issue date Mar 1, 2022
- Industrial Technology Research Institute
- Jui-Chang Chuang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE
- Publication number 20240395730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS
- Publication number 20240395772
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20240387188
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Liners to Facilitate The Formation of Copper-Containing Via...
- Publication number 20240379556
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240379748
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFTING MODULE AND ELECTRONIC DEVICE
- Publication number 20240365493
- Publication date Oct 31, 2024
- Wistron Corporation
- Yin Tseng Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCROLL DEVICE AND SCROLLABLE DISPLAY
- Publication number 20240357755
- Publication date Oct 24, 2024
- E Ink Holdings Inc.
- Hsing-Kai WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A NANO-FET SEMICONDUCTOR DEVICE
- Publication number 20240332401
- Publication date Oct 3, 2024
- Tawan Semiconductor Manufacturing Co., Ltd.
- Li-Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY STRUCTURE AND DISPLAY DEVICE
- Publication number 20240321900
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Chao Feng Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING ON ASSEMBLED WAFER
- Publication number 20240321883
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS...
- Publication number 20240304466
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PAPER DISPLAY DEVICE
- Publication number 20240295790
- Publication date Sep 5, 2024
- E Ink Holdings Inc.
- Ming-Huan YANG
- G02 - OPTICS
Information Patent Application
FLEXIBLE DISPLAY PANEL AND FLEXIBLE DISPLAY DEVICE
- Publication number 20240298414
- Publication date Sep 5, 2024
- E Ink Holdings Inc.
- Yi-Sheng LIN
- B32 - LAYERED PRODUCTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240288741
- Publication date Aug 29, 2024
- E Ink Holdings Inc.
- Wei-Sung Cheng
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240282815
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240282814
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240266285
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240241420
- Publication date Jul 18, 2024
- E Ink Holdings Inc.
- Ling-Chiang Chu
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE AND HINGE MECHANISM THEREOF
- Publication number 20240229858
- Publication date Jul 11, 2024
- Wistron Corporation
- Chih-Wei KUO
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
LASER DE-BONDING CARRIERS AND COMPOSITE CARRIERS THEREOF
- Publication number 20240153786
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Chen-Fa Tsai

Person

Patents Grantslast 30 patents

Irregular mechanical motion detection systems and method

Package structure and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Bonding and isolation techniques for stacked transistor structures

High electron mobility transistor device having a barrier layer wit...

Ambient controlled two-step thermal treatment for spin-on coating l...

Method of forming a nano-FET semiconductor device

Method of fabricating semiconductor device having dummy micro bumps...

Bonding structures of integrated circuit devices and method forming...

Semiconductor package and manufacturing method thereof

Heat dissipation for semiconductor devices and methods of manufacture

Laser de-bonding carriers and composite carriers thereof

Ambient controlled two-step thermal treatment for spin-on coating l...

Placement method and non-transitory computer readable storage medium

Semiconductor package and manufacturing method thereof

Ion implantation with annealing for substrate cutting

Flexible display panel

Package structure with underfill

Package structure and manufacturing method thereof

Irregular mechanical motion detection systems and method

Integrated circuits having protruding interconnect conductors

Electronic apparatus

Display apparatus and driving method thereof

Plating apparatus for plating semiconductor wafer and plating method

Apparatus and method for wafer pre-wetting

Silicide backside contact

Methods of forming contact features in semiconductor devices

Method of making semiconductor device package including conformal m...

Package structure and manufacturing method thereof

Impact resistant structure and electronic device

Patents Applicationslast 30 patents

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE

PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

Wafer Bonding Apparatus and Method

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

BONDING SYSTEM AND METHOD FOR USING THE SAME

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

Forming Liners to Facilitate The Formation of Copper-Containing Via...

Bonding and Isolation Techniques for Stacked Transistor Structures

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

LIFTING MODULE AND ELECTRONIC DEVICE

SCROLL DEVICE AND SCROLLABLE DISPLAY

METHOD OF FORMING A NANO-FET SEMICONDUCTOR DEVICE

ARRAY SUBSTRATE, DISPLAY STRUCTURE AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING ON ASSEMBLED WAFER

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS...

ELECTRONIC PAPER DISPLAY DEVICE

FLEXIBLE DISPLAY PANEL AND FLEXIBLE DISPLAY DEVICE

DISPLAY DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Bonding and Isolation Techniques for Stacked Transistor Structures

Bonding and Isolation Techniques for Stacked Transistor Structures

HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

DISPLAY DEVICE

ELECTRONIC DEVICE AND HINGE MECHANISM THEREOF

LASER DE-BONDING CARRIERS AND COMPOSITE CARRIERS THEREOF