Chen-Fa Tsai

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for wafer pre-wetting
- Patent number 12,366,004
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Temperature controllable bonder equipment for substrate bonding
- Patent number 12,368,129
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 12,347,696
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 12,327,811
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device
- Patent number 12,308,549
- Issue date May 20, 2025
- Lite-On Technology Corporation
- Shuo-Jen Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,278,203
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable chemical vapor deposition (FCVD) using multi-step anneal t...
- Patent number 12,266,574
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic bonding gap control and tool for wafer bonding
- Patent number 12,249,592
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display device having supporting layer
- Patent number 12,243,448
- Issue date Mar 4, 2025
- E Ink Holdings Inc.
- Kuo Chang Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonding system with sealing gasket and method for using the same
- Patent number 12,237,211
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising dummy feature interposed between...
- Patent number 12,237,284
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 12,227,867
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device, method of manufacture by monitoring relative...
- Patent number 12,230,532
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and fabrication method of the same
- Patent number 12,222,625
- Issue date Feb 11, 2025
- E Ink Holdings Inc.
- Chia-Chun Yeh
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 12,211,820
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Irregular mechanical motion detection systems and method
- Patent number 12,172,262
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chunhung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,142,579
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and isolation techniques for stacked transistor structures
- Patent number 12,132,079
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor device having a barrier layer wit...
- Patent number 12,100,756
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Hao-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 12,087,592
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a nano-FET semiconductor device
- Patent number 12,040,382
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device having dummy micro bumps...
- Patent number 12,020,952
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation for semiconductor devices and methods of manufacture
- Patent number 11,990,404
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 11,908,708
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 11,901,189
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY
- Publication number 20250231589
- Publication date Jul 17, 2025
- E Ink Holdings Inc.
- Yi-Sheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPSULE TYPE ELECTROPHORETIC DISPLAY MEDIUM FILM AND MANUFACTURING...
- Publication number 20250224648
- Publication date Jul 10, 2025
- E Ink Holdings Inc.
- Chao Feng Sung
- G02 - OPTICS
Information Patent Application
LDO POWER SUPPLY REJECTION RATIO IMPROVEMENT WITH SIMPLE FEED-FORWA...
- Publication number 20250216882
- Publication date Jul 3, 2025
- MEDIATEK INC.
- Chen-Han Tsai
- G05 - CONTROLLING REGULATING
Information Patent Application
FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) USING MULTI-STEP ANNEAL T...
- Publication number 20250204019
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DISCHARGE MACHINING EQUIPMENT AND METHOD WITH EQUAL-ENER...
- Publication number 20250196243
- Publication date Jun 19, 2025
- National Taiwan Normal University
- Shun-Tong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME
- Publication number 20250191968
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR BACKPLANE STRUCTURE
- Publication number 20250194250
- Publication date Jun 12, 2025
- E Ink Holdings Inc.
- Chao Feng Sung
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250167149
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20250163602
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250151384
- Publication date May 8, 2025
- UNITED MICROELECTRONICS CORP.
- Shuo-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method of Manufacture by Monitoring Relative...
- Publication number 20250149378
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLET AND CHARGER HAVING THE SAME
- Publication number 20250096584
- Publication date Mar 20, 2025
- LITE-ON TECHNOLOGY CORPORATION
- Chen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL REGIONS IN STACKED TRANSISTORS AND METHODS OF FORMING THE SAME
- Publication number 20250089313
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLUETOOTH CONNECTION SYSTEM AND BLUETOOTH CONNECTION METHOD
- Publication number 20250071843
- Publication date Feb 27, 2025
- BENQ CORPORATION
- Chih-Hung LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE
- Publication number 20240395730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS
- Publication number 20240395772
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20240387188
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Liners to Facilitate The Formation of Copper-Containing Via...
- Publication number 20240379556
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240379748
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFTING MODULE AND ELECTRONIC DEVICE
- Publication number 20240365493
- Publication date Oct 31, 2024
- Wistron Corporation
- Yin Tseng Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCROLL DEVICE AND SCROLLABLE DISPLAY
- Publication number 20240357755
- Publication date Oct 24, 2024
- E Ink Holdings Inc.
- Hsing-Kai WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chen-Fa Tsai

Person

Patents Grantslast 30 patents

Apparatus and method for wafer pre-wetting

Temperature controllable bonder equipment for substrate bonding

Laser de-bonding carriers and composite carriers thereof

Ion implantation with annealing for substrate cutting

Power device

Semiconductor structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Flowable chemical vapor deposition (FCVD) using multi-step anneal t...

Wafer bonding system and method of using the same

Dynamic bonding gap control and tool for wafer bonding

Flexible display device having supporting layer

Bonding system with sealing gasket and method for using the same

Semiconductor structure comprising dummy feature interposed between...

Plating apparatus for plating semiconductor wafer and plating method

Semiconductor device, method of manufacture by monitoring relative...

Display device and fabrication method of the same

Wafer bonding apparatus and method

Irregular mechanical motion detection systems and method

Package structure and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Bonding and isolation techniques for stacked transistor structures

High electron mobility transistor device having a barrier layer wit...

Ambient controlled two-step thermal treatment for spin-on coating l...

Method of forming a nano-FET semiconductor device

Method of fabricating semiconductor device having dummy micro bumps...

Bonding structures of integrated circuit devices and method forming...

Semiconductor package and manufacturing method thereof

Heat dissipation for semiconductor devices and methods of manufacture

Laser de-bonding carriers and composite carriers thereof

Ambient controlled two-step thermal treatment for spin-on coating l...

Patents Applicationslast 30 patents

DISPLAY

CAPSULE TYPE ELECTROPHORETIC DISPLAY MEDIUM FILM AND MANUFACTURING...

LDO POWER SUPPLY REJECTION RATIO IMPROVEMENT WITH SIMPLE FEED-FORWA...

FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) USING MULTI-STEP ANNEAL T...

ELECTRICAL DISCHARGE MACHINING EQUIPMENT AND METHOD WITH EQUAL-ENER...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

TRANSISTOR BACKPLANE STRUCTURE

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device, Method of Manufacture by Monitoring Relative...

INLET AND CHARGER HAVING THE SAME

CHANNEL REGIONS IN STACKED TRANSISTORS AND METHODS OF FORMING THE SAME

BLUETOOTH CONNECTION SYSTEM AND BLUETOOTH CONNECTION METHOD

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE

PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

Wafer Bonding Apparatus and Method

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

BONDING SYSTEM AND METHOD FOR USING THE SAME

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

Forming Liners to Facilitate The Formation of Copper-Containing Via...

Bonding and Isolation Techniques for Stacked Transistor Structures

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

LIFTING MODULE AND ELECTRONIC DEVICE

SCROLL DEVICE AND SCROLLABLE DISPLAY