Chen-Hsiang Lao

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 12,021,006
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising heat dissipation plates
- Patent number 11,996,342
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,810,833
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,715,675
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,302,600
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,062,971
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282659
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20230369162
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230326826
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS, SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURIN...
- Publication number 20230075909
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230064253
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220189844
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20210343619
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210193550
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20200219786
- Publication date Jul 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Chen-Hsiang Lao

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Package structure and method and equipment for forming the same

Semiconductor package comprising heat dissipation plates

Package structure and method and equipment for forming the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Package structure and method and equipment for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Package Structure and Method and Equipment for Forming the Same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC APPARATUS, SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURIN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package Structure and Method and Equipment for Forming the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package Structure and Method and Equipment for Forming the Same