TREA

Chen-Kuang Lien

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  • Kaohsiung City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electrochemical plating
    • Patent number 10,704,158
    • Issue date Jul 7, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Kuang Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrochemical plating
    • Patent number 9,518,332
    • Issue date Dec 13, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Kuang Lien
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Barrier layer for copper interconnect
    • Patent number 9,064,934
    • Issue date Jun 23, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Barrier layer for copper interconnect
    • Patent number 8,872,342
    • Issue date Oct 28, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Barrier layer for copper interconnect
    • Patent number 8,722,531
    • Issue date May 13, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method and apparatus for back end of line semiconductor device proc...
    • Patent number 8,673,765
    • Issue date Mar 18, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hung-Chih Wang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Electrochemical Plating
    • Publication number 20170088970
    • Publication date Mar 30, 2017
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
    • Chen-Kuang Lien
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Barrier Layer for Copper Interconnect
    • Publication number 20150044867
    • Publication date Feb 12, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Barrier Layer for Copper Interconnect
    • Publication number 20140191402
    • Publication date Jul 10, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BARRIER LAYER FOR COPPER INTERCONNECT
    • Publication number 20140117547
    • Publication date May 1, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method and Apparatus for Back End of Line Semiconductor Device Proc...
    • Publication number 20130320539
    • Publication date Dec 5, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hung-Chih Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROCHEMICAL PLATING
    • Publication number 20120234683
    • Publication date Sep 20, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Kuang Lien
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR