Chen-Ming Yang

Person

Taipei-Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for wafer level chip scale packaging with passive components...
- Patent number 7,582,511
- Issue date Sep 1, 2009
- Touch Micro-System Technology Inc.
- Chen Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing a double-sided process
- Patent number 7,566,574
- Issue date Jul 28, 2009
- Touch Micro-System Technology Inc.
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating suspended structure
- Patent number 7,531,457
- Issue date May 12, 2009
- Touch Micro-System Technology Inc.
- Yu-Fu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming suspended structure
- Patent number 7,465,601
- Issue date Dec 16, 2008
- Touch Micro-System Technology Inc.
- Yu-Fu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of performing a double-sided process
- Patent number 7,306,955
- Issue date Dec 11, 2007
- Touch Micro-System Technology Inc.
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of segmenting a wafer
- Patent number 7,297,610
- Issue date Nov 20, 2007
- Touch Micro-System Technology Inc.
- Chen-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of double-sided etching
- Patent number 7,256,128
- Issue date Aug 14, 2007
- Touch Micro-System Technology Inc.
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding wafers
- Patent number 7,192,842
- Issue date Mar 20, 2007
- Touch Micro-Systems Technology Inc.
- Shih-Feng Shao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching cavities having different aspect ratios
- Patent number 7,045,463
- Issue date May 16, 2006
- Touch Micro-System Technology Inc.
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a wafer backside interconnecting wire
- Patent number 7,008,821
- Issue date Mar 7, 2006
- Touch Micro-System Technology Inc.
- Shih-Feng Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Duplex communication apparatus for motor vehicle
- Patent number 6,559,759
- Issue date May 6, 2003
- Chih-Chung Chien
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SUSPENDED STRUCTURE
- Publication number 20080138923
- Publication date Jun 12, 2008
- Yu-Fu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PERFORMING A DOUBLE-SIDED PROCESS
- Publication number 20070298582
- Publication date Dec 27, 2007
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING SUSPENDED STRUCTURE
- Publication number 20070293023
- Publication date Dec 20, 2007
- Yu-Fu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF SEGMENTING WAFER
- Publication number 20070184633
- Publication date Aug 9, 2007
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PERFORMING A DOUBLE-SIDED PROCESS
- Publication number 20070111472
- Publication date May 17, 2007
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF THINNING A WAFER
- Publication number 20070004172
- Publication date Jan 4, 2007
- Chen-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEGMENTING A WAFER
- Publication number 20060276005
- Publication date Dec 7, 2006
- Chen-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEGMENTING A WAFER
- Publication number 20060276006
- Publication date Dec 7, 2006
- Chen-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS
- Publication number 20060084238
- Publication date Apr 20, 2006
- Shih-Feng Shao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING A WAFER BACKSIDE INTERCONNECTING WIRE
- Publication number 20060057775
- Publication date Mar 16, 2006
- Shih-Feng Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING A WAFER
- Publication number 20060030130
- Publication date Feb 9, 2006
- Shih-Feng Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of etching cavities having different aspect ratios
- Publication number 20060024965
- Publication date Feb 2, 2006
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF DOUBLE-SIDED ETCHING
- Publication number 20060021965
- Publication date Feb 2, 2006
- Chen-Hsiung Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUPLEX COMMUNICATION APPARATUS FOR MOTOR VEHICLE
- Publication number 20020175809
- Publication date Nov 28, 2002
- Chih-Chung Chien
- B60 - VEHICLES IN GENERAL

Chen-Ming Yang

Person

Patents Grantslast 30 patents

Method for wafer level chip scale packaging with passive components...

Method of performing a double-sided process

Method of fabricating suspended structure

Method of forming suspended structure

Method of performing a double-sided process

Method of segmenting a wafer

Method of double-sided etching

Method for bonding wafers

Method of etching cavities having different aspect ratios

Method of forming a wafer backside interconnecting wire

Duplex communication apparatus for motor vehicle

Patents Applicationslast 30 patents

METHOD OF FORMING SUSPENDED STRUCTURE

METHOD OF PERFORMING A DOUBLE-SIDED PROCESS

METHOD OF FABRICATING SUSPENDED STRUCTURE

METHOD OF SEGMENTING WAFER

METHOD OF PERFORMING A DOUBLE-SIDED PROCESS

METHOD OF THINNING A WAFER

METHOD OF SEGMENTING A WAFER

METHOD OF SEGMENTING A WAFER

METHOD FOR BONDING WAFERS

METHOD OF FORMING A WAFER BACKSIDE INTERCONNECTING WIRE

METHOD OF DICING A WAFER

Method of etching cavities having different aspect ratios

METHOD OF DOUBLE-SIDED ETCHING

DUPLEX COMMUNICATION APPARATUS FOR MOTOR VEHICLE