Chen-Nan Lai

Follow

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip stacking and packaging structure
- Patent number 11,876,037
- Issue date Jan 16, 2024
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP STACKING AND PACKAGING STRUCTURE
- Publication number 20230420339
- Publication date Dec 28, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD.
- CHEN-NAN LAI
- H01 - BASIC ELECTRIC ELEMENTS