Chen Seong CHUA

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Exposed die package that helps protect the exposed die from damage
- Patent number 8,847,370
- Issue date Sep 30, 2014
- Texas Instruments Incorporated
- Lee Han Meng Eugene Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE
- Publication number 20130127029
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN FOR EXPOSED DIE PACKAGE
- Publication number 20130087901
- Publication date Apr 11, 2013
- National Semiconductor Corporation
- Lee Han Meng @ Eugene LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL