Chen Wang

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New Haven, CT, US

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Patents Grantslast 30 patents

Information Patent Grant
Techniques for manipulation of two-qubit quantum states and related...
- Patent number 11,184,006
- Issue date Nov 23, 2021
- Yale University
- Chen Wang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,103,029
- Issue date Oct 16, 2018
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper metallization of through silicon via
- Patent number 7,670,950
- Issue date Mar 2, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR MANIPULATION OF TWO-QUBIT QUANTUM STATES AND RELATED...
- Publication number 20190020346
- Publication date Jan 17, 2019
- Yale University
- Chen WANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Filling Vias in the Microelectronics
- Publication number 20160254156
- Publication date Sep 1, 2016
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
- Publication number 20140120722
- Publication date May 1, 2014
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER METALLIZATION OF THROUGH SILICON VIA
- Publication number 20090035940
- Publication date Feb 5, 2009
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR