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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor die containing silicon nitride stress compensating re...
Patent number
11,430,745
Issue date
Aug 30, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded die assembly containing a manganese-containing oxide bonding...
Patent number
11,362,079
Issue date
Jun 14, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded bonded assembly and method for making the same
Patent number
11,276,705
Issue date
Mar 15, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pads including interfacial electromigration barrier layers...
Patent number
11,270,963
Issue date
Mar 8, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded assembly containing laterally bonded bonding pads and method...
Patent number
11,239,204
Issue date
Feb 1, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded assembly containing a dielectric bonding pattern definition...
Patent number
11,094,653
Issue date
Aug 17, 2021
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded assembly containing horizontal and vertical bonding interfac...
Patent number
11,088,116
Issue date
Aug 10, 2021
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded die assembly containing partially filled through-substrate v...
Patent number
11,037,908
Issue date
Jun 15, 2021
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Porous barrier layer for improving reliability of through-substrate...
Patent number
11,004,773
Issue date
May 11, 2021
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE CONTAINING SILICON NITRIDE STRESS COMPENSATING RE...
Publication number
20210272912
Publication date
Sep 2, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PADS INCLUDING INTERFACIAL ELECTROMIGRATION BARRIER LAYERS...
Publication number
20210217716
Publication date
Jul 15, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED ASSEMBLY CONTAINING LATERALLY BONDED BONDING PADS AND METHOD...
Publication number
20210159215
Publication date
May 27, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED ASSEMBLY CONTAINING HORIZONTAL AND VERTICAL BONDING INTERFAC...
Publication number
20210159216
Publication date
May 27, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN DEFINITION...
Publication number
20210143115
Publication date
May 13, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED BONDED ASSEMBLY AND METHOD FOR MAKING THE SAME
Publication number
20210066317
Publication date
Mar 4, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED DIE ASSEMBLY CONTAINING PARTIALLY FILLED THROUGH-SUBSTRATE V...
Publication number
20210028148
Publication date
Jan 28, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED DIE ASSEMBLY CONTAINING A MANGANESE-CONTAINING OXIDE BONDING...
Publication number
20200395350
Publication date
Dec 17, 2020
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POROUS BARRIER LAYER FOR IMPROVING RELIABILITY OF THROUGH-SUBSTRATE...
Publication number
20200343161
Publication date
Oct 29, 2020
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS