Chen Xiong

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Chengdu Sichuan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 11,515,275
- Issue date Nov 29, 2022
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bond attachment for a semiconductor die
- Patent number 10,692,835
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire ball bonding in semiconductor devices
- Patent number 10,340,246
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20230086535
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20210313291
- Publication date Oct 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE
- Publication number 20190378814
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BALL BONDING IN SEMICONDUCTOR DEVICES
- Publication number 20190221537
- Publication date Jul 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han ZHONG
- H01 - BASIC ELECTRIC ELEMENTS