Chen Yi Gao

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Jiangyin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wire bond and redistribution layer process
- Patent number 7,781,870
- Issue date Aug 24, 2010
- California Micro Devices
- Mitchell M. Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND AND REDISTRIBUTION LAYER PROCESS
- Publication number 20090236690
- Publication date Sep 24, 2009
- CALIFORNIA MICRO DEVICES
- Mitchell M. Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS