Chender Chen

Person

Fongyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Ball grid array package with laser vias and methods for making the...
- Patent number 9,299,589
- Issue date Mar 29, 2016
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame apparatus and method for improved wire bonding
- Patent number 9,202,797
- Issue date Dec 1, 2015
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with laser vias and methods for making the...
- Patent number 9,064,784
- Issue date Jun 23, 2015
- Marvell International Ltd.
- Chenglin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame apparatus and method for improved wire bonding
- Patent number 8,754,513
- Issue date Jun 17, 2014
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ring techniques and configurations
- Patent number 8,749,045
- Issue date Jun 10, 2014
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing heat sink into packaging by strip formation assembly
- Patent number 8,741,694
- Issue date Jun 3, 2014
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing heat sink into packaging by strip formation assembly
- Patent number 8,581,374
- Issue date Nov 12, 2013
- Marvell International Ltd.
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ring techniques and configurations
- Patent number 8,415,785
- Issue date Apr 9, 2013
- Marvell International Ltd
- Chender Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via to plating bus
- Patent number 8,278,563
- Issue date Oct 2, 2012
- Marvell International Ltd.
- Chender Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chender Chen

Person

Patents Grantslast 30 patents

Ball grid array package with laser vias and methods for making the...

Lead frame apparatus and method for improved wire bonding

Ball grid array package with laser vias and methods for making the...

Lead frame apparatus and method for improved wire bonding

Metal ring techniques and configurations

Placing heat sink into packaging by strip formation assembly

Placing heat sink into packaging by strip formation assembly

Metal ring techniques and configurations

Via to plating bus