Cheng-Chi Wang

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Yungkang City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Hillock-free aluminum wiring layer and method of forming the same
- Patent number 6,620,527
- Issue date Sep 16, 2003
- Chi Mei Optoelectronics Corp.
- Cheng-Chi Wang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Hillock-free aluminum wiring layer and method of forming the same
- Publication number 20030068522
- Publication date Apr 10, 2003
- Cheng-Chi Wang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...