Cheng-Chi WONG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,862,577
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holder, wafer chuck, wafer holding method
- Patent number 11,791,192
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages and methods of forming the same
- Patent number 11,664,300
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method and system
- Patent number 11,610,859
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 11,211,341
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of singulate a package structure using a light transmitting...
- Patent number 10,903,090
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 10,868,353
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus of multi-stage network for iterative decoding and method...
- Patent number 7,724,163
- Issue date May 25, 2010
- National Chiao Tung University
- Cheng-Chi Wong
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20240186275
- Publication date Jun 6, 2024
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105642
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088062
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...
- Publication number 20230369094
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20230197671
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Trimming and Sawing Processes in the Formation of Wafer-Form Packages
- Publication number 20230178536
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230068263
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Packages and Methods of Forming the Same
- Publication number 20220359356
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20220130795
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220122926
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20210225684
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Packages and Methods of Forming the Same
- Publication number 20210202358
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
- Publication number 20210193589
- Publication date Jun 24, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SINGULATE A PACKAGE STRUCTURE USING A LIGHT TRANSMITTING...
- Publication number 20200365420
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200106156
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS OF MULTI-STAGE NETWORK FOR ITERATIVE DECODING AND METHOD...
- Publication number 20090160686
- Publication date Jun 25, 2009
- National Chiao Tung University
- Cheng-Chi WONG
- H03 - BASIC ELECTRONIC CIRCUITRY

Cheng-Chi WONG

Person

Patents Grantslast 30 patents

Semiconductor structure and method of forming the same

Package structure and method of fabricating the same

Workpiece holder, wafer chuck, wafer holding method

Fan-out packages and methods of forming the same

Reflow method and system

Package structure and method of fabrcating the same

Method of singulate a package structure using a light transmitting...

Electronic device and manufacturing method thereof

Apparatus of multi-stage network for iterative decoding and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

Semiconductor Devices and Methods of Forming the Same

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...

REFLOW METHOD AND SYSTEM

Trimming and Sawing Processes in the Formation of Wafer-Form Packages

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Fan-Out Packages and Methods of Forming the Same

REFLOW METHOD AND SYSTEM

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

Fan-Out Packages and Methods of Forming the Same

PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME

METHOD OF SINGULATE A PACKAGE STRUCTURE USING A LIGHT TRANSMITTING...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS OF MULTI-STAGE NETWORK FOR ITERATIVE DECODING AND METHOD...