Cheng-Chung CHU

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Implementation of deep neural networks for testing and quality cont...
- Patent number 12,124,247
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Fei Zhou
- G05 - CONTROLLING REGULATING
Information Patent Grant
Virtual metrology for feature profile prediction in the production...
- Patent number 12,009,269
- Issue date Jun 11, 2024
- SANDISK TECHNOLOGIES LLC
- Cheng-Chung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementation of deep neural networks for testing and quality cont...
- Patent number 11,947,890
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Cheng-Chung Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Offset backside contact via structures for a three-dimensional memo...
- Patent number 10,103,161
- Issue date Oct 16, 2018
- SanDisk Technologies LLC
- Fumitoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with leakage reducing support pilla...
- Patent number 10,014,316
- Issue date Jul 3, 2018
- SanDisk Technologies LLC
- Fabo Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-plane offset in backside contact via structures for a three-d...
- Patent number 9,917,093
- Issue date Mar 13, 2018
- SanDisk Technologies LLC
- Cheng-Chung Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPLEMENTATION OF DEEP NEURAL NETWORKS FOR TESTING AND QUALITY CONT...
- Publication number 20240202425
- Publication date Jun 20, 2024
- SanDisk Technologies LLC
- Cheng-Chung Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIRTUAL METROLOGY FOR FEATURE PROFILE PREDICTION IN THE PRODUCTION...
- Publication number 20220415718
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Cheng-Chung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION OF DEEP NEURAL NETWORKS FOR TESTING AND QUALITY CONT...
- Publication number 20210397170
- Publication date Dec 23, 2021
- SANDISK TECHNOLOGIES LLC
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION OF DEEP NEURAL NETWORKS FOR TESTING AND QUALITY CONT...
- Publication number 20200356718
- Publication date Nov 12, 2020
- SANDISK TECHNOLOGIES LLC
- Cheng-Chung Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LEAKAGE REDUCING SUPPORT PILLA...
- Publication number 20180108671
- Publication date Apr 19, 2018
- SanDisk Technologies LLC
- Fabo YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET BACKSIDE CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMO...
- Publication number 20170373087
- Publication date Dec 28, 2017
- SanDisk Technologies LLC
- Fumitoshi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-PLANE OFFSET IN BACKSIDE CONTACT VIA STRUCTURES FOR A THREE-D...
- Publication number 20170373078
- Publication date Dec 28, 2017
- SanDisk Technologies LLC
- Cheng-Chung CHU
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Chung CHU

Person

Patents Grantslast 30 patents

Implementation of deep neural networks for testing and quality cont...

Virtual metrology for feature profile prediction in the production...

Implementation of deep neural networks for testing and quality cont...

Offset backside contact via structures for a three-dimensional memo...

Three-dimensional memory device with leakage reducing support pilla...

Inter-plane offset in backside contact via structures for a three-d...

Patents Applicationslast 30 patents

IMPLEMENTATION OF DEEP NEURAL NETWORKS FOR TESTING AND QUALITY CONT...

VIRTUAL METROLOGY FOR FEATURE PROFILE PREDICTION IN THE PRODUCTION...

IMPLEMENTATION OF DEEP NEURAL NETWORKS FOR TESTING AND QUALITY CONT...

IMPLEMENTATION OF DEEP NEURAL NETWORKS FOR TESTING AND QUALITY CONT...

THREE-DIMENSIONAL MEMORY DEVICE WITH LEAKAGE REDUCING SUPPORT PILLA...

OFFSET BACKSIDE CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMO...

INTER-PLANE OFFSET IN BACKSIDE CONTACT VIA STRUCTURES FOR A THREE-D...