Cheng Gek Cheok

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
Method of forming a composite standoff on a circuit board
- Publication number 20070119911
- Publication date May 31, 2007
- Su Liang Chan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board surface mount package
- Publication number 20050173152
- Publication date Aug 11, 2005
- Scott E. Post
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...