Cheng-Hao Ciou

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,748,183
- Issue date Aug 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,627,307
- Issue date Apr 18, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170186703
- Publication date Jun 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160133556
- Publication date May 12, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS