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Cheng-Hong Wei
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Taichung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of semiconductor structure
Patent number
11,978,768
Issue date
May 7, 2024
Winbond Electronics Corp.
Tseng-Yao Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resistive random access memory and manufacturing method thereof
Patent number
11,778,932
Issue date
Oct 3, 2023
Winbond Electronics Corp.
Cheng-Hong Wei
Information
Patent Grant
Memory device having contact plugs with narrower and wider portions
Patent number
11,764,274
Issue date
Sep 19, 2023
Winbond Electronics Corp.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,721,720
Issue date
Aug 8, 2023
Winbond Electronics Corp.
Tseng-Yao Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a memory device
Patent number
11,056,564
Issue date
Jul 6, 2021
Winbond Electronics Corp.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor chip
Patent number
10,957,594
Issue date
Mar 23, 2021
Winbond Electronics Corp.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of wafer dicing and die
Patent number
10,685,883
Issue date
Jun 16, 2020
Winbond Electronics Corp.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of wafer dicing
Patent number
10,515,853
Issue date
Dec 24, 2019
Winbond Electronics Corp.
Ching-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING RESISTIVE RANDOM ACCESS MEMORY
Publication number
20230397513
Publication date
Dec 7, 2023
WINBOND ELECTRONICS CORP.
Cheng-Hong Wei
Information
Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230337424
Publication date
Oct 19, 2023
WINBOND ELECTRONICS CORP.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Publication number
20230317781
Publication date
Oct 5, 2023
WINBOND ELECTRONICS CORP.
Tseng-Yao Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACURING METHOD THEREOF
Publication number
20220302254
Publication date
Sep 22, 2022
WINBOND ELECTRONICS CORP.
Tseng-Yao Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING THE SAME
Publication number
20210398858
Publication date
Dec 23, 2021
WINBOND ELECTRONICS CORP.
Tseng-Yao PAN
G11 - INFORMATION STORAGE
Information
Patent Application
MEMORY DEVICE
Publication number
20210273064
Publication date
Sep 2, 2021
WINBOND ELECTRONICS CORP.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF
Publication number
20210159406
Publication date
May 27, 2021
WINBOND ELECTRONICS CORP.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20200203492
Publication date
Jun 25, 2020
WINBOND ELECTRONICS CORP.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
Publication number
20200111707
Publication date
Apr 9, 2020
WINBOND ELECTRONICS CORP.
Cheng-Hong Wei
H01 - BASIC ELECTRIC ELEMENTS