Cheng-hsien Chiu

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Kaohsing city, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device protective structure and method for fabricatin...
- Patent number 7,416,920
- Issue date Aug 26, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with coplanar filling paste and dice and with p...
- Patent number 7,400,037
- Issue date Jul 15, 2008
- Advanced Chip Engineering Tachnology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device protective structure and method for fabricatin...
- Patent number 7,176,567
- Issue date Feb 13, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PROTECTIVE STRUCTURE AND METHOD FOR FABRICATIN...
- Publication number 20070082428
- Publication date Apr 12, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROTECTIVE STRUCTURE AND METHOD FOR FABRICATIN...
- Publication number 20070007648
- Publication date Jan 11, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling paste structure and process for WL-CSP
- Publication number 20060145364
- Publication date Jul 6, 2006
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS