Cheng-Hung Shih

Person

Lugang Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Surface acoustic wave device and method of manufacturing the same
- Patent number 11,522,517
- Issue date Dec 6, 2022
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage container for electronic devices
- Patent number 11,148,864
- Issue date Oct 19, 2021
- Chipbond Technology Corporation
- Cheng-Hung Shih
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device having 3D inductor and method of manufacturing...
- Patent number 11,056,555
- Issue date Jul 6, 2021
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating system and pressure device thereof
- Patent number 10,808,331
- Issue date Oct 20, 2020
- Chipbond Technology Corporation
- Cheng-Hung Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip package and chip thereof
- Patent number 10,797,213
- Issue date Oct 6, 2020
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having hollow chamber and bottom su...
- Patent number 9,508,676
- Issue date Nov 29, 2016
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of photoresist strip
- Patent number 9,230,823
- Issue date Jan 5, 2016
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing process and structure thereof
- Patent number 8,877,629
- Issue date Nov 4, 2014
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pyramid bump structure
- Patent number 8,692,390
- Issue date Apr 8, 2014
- Chipbond Technology Corporation
- Chih-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and semiconductor structure thereof
- Patent number 8,581,239
- Issue date Nov 12, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing fine-pitch bumps and structure thereof
- Patent number 8,530,344
- Issue date Sep 10, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing fine-pitch bumps and structure thereof
- Patent number 8,501,614
- Issue date Aug 6, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and structure thereof
- Patent number 8,497,579
- Issue date Jul 30, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming an anti-oxidant metal layer on an electronic de...
- Patent number 8,450,049
- Issue date May 28, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and process of manufacturing the same
- Patent number 8,437,142
- Issue date May 7, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure and process of manufacturing the same
- Patent number 8,330,280
- Issue date Dec 11, 2012
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038052
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220337216
- Publication date Oct 20, 2022
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210013865
- Publication date Jan 14, 2021
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING 3D INDUCTOR AND METHOD OF MANUFACTURING...
- Publication number 20200295123
- Publication date Sep 17, 2020
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING 3D INDUCTOR AND METHOD OF MANUFACTURING...
- Publication number 20200266262
- Publication date Aug 20, 2020
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP THEREOF
- Publication number 20200091385
- Publication date Mar 19, 2020
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING SYSTEM AND PRESSURE DEVICE THEREOF
- Publication number 20190186037
- Publication date Jun 20, 2019
- Chipbond Technology Corporation
- Cheng-Hung Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE HAVING HOLLOW CHAMBER
- Publication number 20160318756
- Publication date Nov 3, 2016
- Chipbond Technology Corporation
- Cheng-Hung Shih
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRACE STRUCTURE OF FINE-PITCH PATTERN
- Publication number 20160020166
- Publication date Jan 21, 2016
- Chipbond Technology Corporation
- Yung-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF
- Publication number 20140367856
- Publication date Dec 18, 2014
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF
- Publication number 20140159234
- Publication date Jun 12, 2014
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130256882
- Publication date Oct 3, 2013
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
- Publication number 20130252374
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130249089
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
- Publication number 20130249081
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
- Publication number 20130214407
- Publication date Aug 22, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
- Publication number 20130214419
- Publication date Aug 22, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20130187265
- Publication date Jul 25, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME
- Publication number 20120318570
- Publication date Dec 20, 2012
- Cheng-Hung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME
- Publication number 20120319271
- Publication date Dec 20, 2012
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PYRAMID BUMP STRUCTURE
- Publication number 20120211257
- Publication date Aug 23, 2012
- Chih-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DE...
- Publication number 20120208129
- Publication date Aug 16, 2012
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Hung Shih

Person

Patents Grantslast 30 patents

Surface acoustic wave device and method of manufacturing the same

Storage container for electronic devices

Semiconductor device having 3D inductor and method of manufacturing...

Electroplating system and pressure device thereof

Chip package and chip thereof

Semiconductor package structure having hollow chamber and bottom su...

Method of photoresist strip

Semiconductor manufacturing process and structure thereof

Pyramid bump structure

Package structure and semiconductor structure thereof

Method for manufacturing fine-pitch bumps and structure thereof

Method for manufacturing fine-pitch bumps and structure thereof

Semiconductor packaging method and structure thereof

Process for forming an anti-oxidant metal layer on an electronic de...

Bump structure and process of manufacturing the same

Bump structure and process of manufacturing the same

Patents Applicationslast 30 patents

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING 3D INDUCTOR AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE HAVING 3D INDUCTOR AND METHOD OF MANUFACTURING...

CHIP PACKAGE AND CHIP THEREOF

ELECTROPLATING SYSTEM AND PRESSURE DEVICE THEREOF

PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE HAVING HOLLOW CHAMBER

TRACE STRUCTURE OF FINE-PITCH PATTERN

SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF

SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF

SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME

BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME

PYRAMID BUMP STRUCTURE

PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DE...