Cheng-Kang Hu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for handling semiconductor part carriers
- Patent number 12,165,906
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ren-Hau Wu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Power saving method for lower power devices, electronic device and...
- Patent number 12,160,733
- Issue date Dec 3, 2024
- CyberTAN Technology, Inc.
- Cheng-Wei Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for raised floor automated sensor vehicles
- Patent number 12,153,433
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Kang Hu
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wafer transfer system and a method for transporting wafers
- Patent number 12,125,727
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display circuitry with semiconducting oxide transistors
- Patent number 12,096,657
- Issue date Sep 17, 2024
- Apple Inc.
- Jung Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical inspection of a wafer
- Patent number 11,954,841
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lieh Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for inspecting wafer carriers
- Patent number 11,929,271
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Kang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for automated wafer carrier handling
- Patent number 11,915,958
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer cooling
- Patent number 11,768,484
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Yao Lee
- G05 - CONTROLLING REGULATING
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for map-free inspection of semiconductor devices
- Patent number 11,651,981
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiao-Rou Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical inspection of a wafer
- Patent number 11,423,526
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lieh Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for raised floor automated sensor vehicles
- Patent number 11,334,080
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Kang Hu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and method for automated wafer carrier handling
- Patent number 11,295,973
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing stage profiler jig
- Patent number 11,152,238
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Kang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topological scanning method and system
- Patent number 11,120,539
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Hsiang Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device positioning using sensors
- Patent number 10,971,386
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yan-Han Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer debonding system and method
- Patent number 10,889,097
- Issue date Jan 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Chen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for inspecting wafer carriers
- Patent number 10,714,364
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Kang Hu
- G01 - MEASURING TESTING
Information Patent Grant
Wafer debonding system and method
- Patent number 10,569,520
- Issue date Feb 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer debonding system and method
- Patent number 10,155,369
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Grant
High-throughput system and method for post-implantation single wafe...
- Patent number 9,982,338
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Jen Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-throughput system and method for post-implantation single wafe...
- Patent number 9,663,854
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Jen Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for carbon ion source head
- Patent number 9,196,452
- Issue date Nov 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband power line network device and ethernet signal coupling de...
- Patent number 9,191,071
- Issue date Nov 17, 2015
- Alpha Networks Inc.
- Hsiu-Wu Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for fabricating an electrode structure for a cylindrical cap...
- Patent number 6,110,835
- Issue date Aug 29, 2000
- United Microelectronics Corp.
- Chuan-Fu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER TRANSFER SYSTEM AND A METHOD FOR TRANSPORTING WAFERS
- Publication number 20240387218
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR RAISED FLOOR AUTOMATED SENSOR VEHICLES
- Publication number 20240377826
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Cheng-Kang HU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD AND SYSTEM OF REMOVING PARTICLES FROM PELLICLE
- Publication number 20240353767
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Kang HU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
OPTICAL INSPECTION OF A WAFER
- Publication number 20240202903
- Publication date Jun 20, 2024
- Taiwan Samiconductor Manufacturing Company, Ltd.
- Chih-Lieh CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS
- Publication number 20240186162
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Kang HU
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING
- Publication number 20240153806
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER COOLING
- Publication number 20230384776
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Yao LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SAVING METHOD FOR LOWER POWER DEVICES, ELECTRONIC DEVICE AND...
- Publication number 20230388791
- Publication date Nov 30, 2023
- CyberTAN Technology, Inc.
- CHENG-WEI HU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WAFER TRANSFER SYSTEM AND A METHOD FOR TRANSPORTING WAFERS
- Publication number 20230326776
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HUMIDITY CONTROL DEVICE FOR EQUIPMENT FRONT END MODULE OF SEMICONDU...
- Publication number 20230207359
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER COOLING
- Publication number 20220317668
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yung-Yao LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL INSPECTION OF A WAFER
- Publication number 20220292667
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lieh CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR RAISED FLOOR AUTOMATED SENSOR VEHICLES
- Publication number 20220261001
- Publication date Aug 18, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Cheng-Kang HU
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING
- Publication number 20220216075
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Circuitry with Semiconducting Oxide Transistors
- Publication number 20220181418
- Publication date Jun 9, 2022
- Apple Inc.
- Jung Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INSPECTION OF A WAFER
- Publication number 20220156911
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Lieh CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR MAP-FREE INSPECTION OF SEMICONDUCTOR DEVICES
- Publication number 20220059376
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Becky LIAO
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING
- Publication number 20210249282
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20210242043
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE POSITIONING USING SENSORS
- Publication number 20210082718
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yan-Han CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS
- Publication number 20200343115
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Kang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR HANDLING SEMICONDUCTOR PART CARRIERS
- Publication number 20200161161
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ren-Hau WU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20200108592
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
TOPOLOGICAL SCANNING METHOD AND SYSTEM
- Publication number 20190244343
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Sheng-Hsiang CHUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PROCESSING STAGE PROFILER JIG
- Publication number 20190164793
- Publication date May 30, 2019
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Cheng-Kang HU
- G05 - CONTROLLING REGULATING
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20190118522
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS
- Publication number 20190067057
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Kang Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER DEBONDING SYSTEM AND METHOD
- Publication number 20180147825
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chen Tsao
- B32 - LAYERED PRODUCTS
Information Patent Application
High-Throughput System and Method for Post-Implantation Single Wafe...
- Publication number 20170247790
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- TSUN-JEN CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Cheng-Kang Hu

Person

Patents Grantslast 30 patents

Apparatus and methods for handling semiconductor part carriers

Power saving method for lower power devices, electronic device and...

Systems and methods for raised floor automated sensor vehicles

Wafer transfer system and a method for transporting wafers

Display circuitry with semiconducting oxide transistors

Optical inspection of a wafer

Apparatus and method for inspecting wafer carriers

Apparatus and method for automated wafer carrier handling

Semiconductor wafer cooling

Fully automated wafer debonding system and method thereof

Method and system for map-free inspection of semiconductor devices

Optical inspection of a wafer

Systems and methods for raised floor automated sensor vehicles

Apparatus and method for automated wafer carrier handling

Semiconductor processing stage profiler jig

Topological scanning method and system

Device positioning using sensors

Wafer debonding system and method

Apparatus and method for inspecting wafer carriers

Wafer debonding system and method

Wafer debonding system and method

High-throughput system and method for post-implantation single wafe...

High-throughput system and method for post-implantation single wafe...

Methods and apparatus for carbon ion source head

Broadband power line network device and ethernet signal coupling de...

Method for fabricating an electrode structure for a cylindrical cap...

Patents Applicationslast 30 patents

WAFER TRANSFER SYSTEM AND A METHOD FOR TRANSPORTING WAFERS

SYSTEMS AND METHODS FOR RAISED FLOOR AUTOMATED SENSOR VEHICLES

METHOD AND SYSTEM OF REMOVING PARTICLES FROM PELLICLE

OPTICAL INSPECTION OF A WAFER

APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS

APPARATUS AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING

SEMICONDUCTOR WAFER COOLING

POWER SAVING METHOD FOR LOWER POWER DEVICES, ELECTRONIC DEVICE AND...

WAFER TRANSFER SYSTEM AND A METHOD FOR TRANSPORTING WAFERS

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

HUMIDITY CONTROL DEVICE FOR EQUIPMENT FRONT END MODULE OF SEMICONDU...

SEMICONDUCTOR WAFER COOLING

OPTICAL INSPECTION OF A WAFER

SYSTEMS AND METHODS FOR RAISED FLOOR AUTOMATED SENSOR VEHICLES

APPARATUS AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING

Display Circuitry with Semiconducting Oxide Transistors

OPTICAL INSPECTION OF A WAFER

METHOD AND SYSTEM FOR MAP-FREE INSPECTION OF SEMICONDUCTOR DEVICES

APPARATUS AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

DEVICE POSITIONING USING SENSORS

APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS

APPARATUS AND METHODS FOR HANDLING SEMICONDUCTOR PART CARRIERS

WAFER DEBONDING SYSTEM AND METHOD

TOPOLOGICAL SCANNING METHOD AND SYSTEM

SEMICONDUCTOR PROCESSING STAGE PROFILER JIG

WAFER DEBONDING SYSTEM AND METHOD

APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS

WAFER DEBONDING SYSTEM AND METHOD

High-Throughput System and Method for Post-Implantation Single Wafe...