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Patents Grants
last 30 patents
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Patent Grant
Bonding stress testing arrangement and method of determining stress
Patent number
9,506,823
Issue date
Nov 29, 2016
Agency for Science, Technology and Research
Cheryl Sharmani Selvanayagam
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HEAT DISSIPATION SYSTEM AND METHOD FOR ELECTRONIC DEVICES
Publication number
20240292567
Publication date
Aug 29, 2024
Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
FWU-BIN HSU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding Stress Testing Arrangement and Method of Determining Stress
Publication number
20130199303
Publication date
Aug 8, 2013
Agency for Science, Technology and Research
Cheryl Sharmani Selvanayagam
G01 - MEASURING TESTING