Cheng Lan Tseng

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wirebonded semiconductor package
- Patent number 8,357,998
- Issue date Jan 22, 2013
- Advanced Semiconductor Engineering, Inc.
- Wen Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PICKING AND PLACING APPARATUS
- Publication number 20240186165
- Publication date Jun 6, 2024
- HERMES-EPITEK CORPORATION
- Cheng-Huang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200969
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200981
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS