Cheng-Ming Weng

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of removing residue left after plasma process
- Patent number 7,687,446
- Issue date Mar 30, 2010
- United Microelectronics Corp.
- Cheng-Ming Weng
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of cleaning wafer after etching process
- Patent number 7,628,866
- Issue date Dec 8, 2009
- United Microelectronics Corp.
- Miao-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascence process utilizing teos-based silicon oxide cap laye...
- Patent number 7,378,343
- Issue date May 27, 2008
- United Microelectronics Corp.
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure and fabrication thereof
- Patent number 7,214,612
- Issue date May 8, 2007
- United Microelectronics Corp.
- Jen-Ren Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing post-etch residue from wafer surface
- Patent number 7,192,878
- Issue date Mar 20, 2007
- United Microelectronics Corp.
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF CLEANING WAFER AFTER ETCHING PROCESS
- Publication number 20080121619
- Publication date May 29, 2008
- United Microelectronics Corp.
- Miao-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene process
- Publication number 20070249165
- Publication date Oct 25, 2007
- Chun-Jen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING AGENT AND METHOD OF REMOVING RESIDUE LEFT AFTER PLASMA PRO...
- Publication number 20070184996
- Publication date Aug 9, 2007
- Cheng-Ming Weng
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE
- Publication number 20070125750
- Publication date Jun 7, 2007
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE PROCESS UTILIZING TEOS-BASED SILICON OXIDE CAP LAYER...
- Publication number 20070111514
- Publication date May 17, 2007
- Jei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE STRUCTURE
- Publication number 20070080386
- Publication date Apr 12, 2007
- United Microelectronics Corp.
- Jen-Ren Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED STRUCTURE AND FABRICATING METHOD THEREOF AND DUAL DAM...
- Publication number 20070052107
- Publication date Mar 8, 2007
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE STRUCTURE AND FABRICATION THEREOF
- Publication number 20070049012
- Publication date Mar 1, 2007
- Jen-Ren Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE
- Publication number 20060252256
- Publication date Nov 9, 2006
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Ming Weng

Person

Patents Grantslast 30 patents

Method of removing residue left after plasma process

Method of cleaning wafer after etching process

Dual damascence process utilizing teos-based silicon oxide cap laye...

Dual damascene structure and fabrication thereof

Method for removing post-etch residue from wafer surface

Patents Applicationslast 30 patents

METHOD OF CLEANING WAFER AFTER ETCHING PROCESS

Dual damascene process

CLEANING AGENT AND METHOD OF REMOVING RESIDUE LEFT AFTER PLASMA PRO...

METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE

DUAL DAMASCENE PROCESS UTILIZING TEOS-BASED SILICON OXIDE CAP LAYER...

DUAL DAMASCENE STRUCTURE

MULTI-LAYERED STRUCTURE AND FABRICATING METHOD THEREOF AND DUAL DAM...

DUAL DAMASCENE STRUCTURE AND FABRICATION THEREOF

METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE