Cheng-Neng Chen

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Changzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Metal circuit structure based on FPC and method of making the same
- Patent number 12,089,331
- Issue date Sep 10, 2024
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Double-sided and multilayer flexible printed circuit (FPC) substrat...
- Patent number 11,406,018
- Issue date Aug 2, 2022
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Sui-Ho Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Metal Circuit Structure Based on FPC and Method of Making the Same
- Publication number 20220361336
- Publication date Nov 10, 2022
- Aplus Semiconductor Technologies Co., Ltd.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrat...
- Publication number 20220272840
- Publication date Aug 25, 2022
- Aplus Semiconductor Technologies Co., Ltd.
- Sui-Ho Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR