Cheng-Pin Chien

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Shulin City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate with a cavity, semiconductor package and fabricat...
- Patent number 8,049,114
- Issue date Nov 1, 2011
- Unimicron Technology Corp.
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE WITH A CAVITY, SEMICONDUCTOR PACKAGE AND FABRICAT...
- Publication number 20100236817
- Publication date Sep 23, 2010
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME
- Publication number 20100206619
- Publication date Aug 19, 2010
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR