Cheng Poh Pour

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
External gettering method and device
- Patent number 10,892,202
- Issue date Jan 12, 2021
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External gettering method and device
- Patent number 10,453,761
- Issue date Oct 22, 2019
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External gettering method and device
- Patent number 9,543,166
- Issue date Jan 10, 2017
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External gettering method and device
- Patent number 9,177,828
- Issue date Nov 3, 2015
- Micron Technology, Inc.
- Michael Tan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked die in die BGA package
- Patent number 8,373,277
- Issue date Feb 12, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,799,610
- Issue date Sep 21, 2010
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die with a recess in a die BGA package
- Patent number 7,575,953
- Issue date Aug 18, 2009
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,371,608
- Issue date May 13, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,358,117
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,344,969
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,819
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,820
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,309,623
- Issue date Dec 18, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die-in-die BGA package with die having a recess
- Patent number 7,282,390
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,282,392
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder masks including dams for at least partially surrounding term...
- Patent number 7,061,124
- Issue date Jun 13, 2006
- Micron Technology, Inc.
- Cher Khng Victor Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EXTERNAL GETTERING METHOD AND DEVICE
- Publication number 20190341321
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL GETTERING METHOD AND DEVICE
- Publication number 20170110381
- Publication date Apr 20, 2017
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL GETTERING METHOD AND DEVICE
- Publication number 20160056051
- Publication date Feb 25, 2016
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE IN DIE BGA PACKAGE
- Publication number 20130154117
- Publication date Jun 20, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL GETTERING METHOD AND APPARATUS
- Publication number 20120205821
- Publication date Aug 16, 2012
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20080136045
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die in Die BGA Package
- Publication number 20080096316
- Publication date Apr 24, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die in Die BGA Package
- Publication number 20080032449
- Publication date Feb 7, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292746
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292743
- Publication date Dec 28, 2006
- Micron Technolgoy, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292745
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060216864
- Publication date Sep 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder masks including dams for at least partially surrounding term...
- Publication number 20050029676
- Publication date Feb 10, 2005
- Cher Khng Victor Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder masks for use on carrier substrates, carrier substrates and...
- Publication number 20040077109
- Publication date Apr 22, 2004
- Cher Khng Victor Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked die in die BGA package
- Publication number 20030207516
- Publication date Nov 6, 2003
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030207515
- Publication date Nov 6, 2003
- Micron Technology, Inc., Boise, ID
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030162325
- Publication date Aug 28, 2003
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030148597
- Publication date Aug 7, 2003
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS

Cheng Poh Pour

Person

Patents Grantslast 30 patents

External gettering method and device

External gettering method and device

External gettering method and device

External gettering method and device

Stacked die in die BGA package

Method of fabricating a stacked die having a recess in a die BGA pa...

Stacked die with a recess in a die BGA package

Method of fabricating a stacked die having a recess in a die BGA pa...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die-in-die BGA package with die having a recess

Method of fabricating a stacked die in die BGA package

Solder masks including dams for at least partially surrounding term...

Patents Applicationslast 30 patents

EXTERNAL GETTERING METHOD AND DEVICE

EXTERNAL GETTERING METHOD AND DEVICE

EXTERNAL GETTERING METHOD AND DEVICE

STACKED DIE IN DIE BGA PACKAGE

EXTERNAL GETTERING METHOD AND APPARATUS

Stacked die in die BGA package

Stacked Die in Die BGA Package

Stacked Die in Die BGA Package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Solder masks including dams for at least partially surrounding term...

Solder masks for use on carrier substrates, carrier substrates and...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package