Cheng Q. Cui

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple integrated circuit die package with thermal performance
- Patent number 8,361,837
- Issue date Jan 29, 2013
- Compass Technology Co. Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball attachment ring and method of use
- Patent number 7,985,672
- Issue date Jul 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple integrated circuit die package with thermal performance
- Patent number 7,906,844
- Issue date Mar 15, 2011
- Compass Technology Co. Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up integrated circuit package with grounded stiffener
- Patent number 7,573,131
- Issue date Aug 11, 2009
- Compass Technology Co., Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for lamination of fluoropolymer to metal and printed circuit...
- Patent number 6,540,866
- Issue date Apr 1, 2003
- Institute of Microelectronics
- Junfeng Zhang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for low temperature lamination of metals to polyimides
- Patent number 6,537,411
- Issue date Mar 25, 2003
- The National University of Singapore
- En-Tang Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for low temperature lamination of metals to fluoropolymers
- Patent number 6,334,926
- Issue date Jan 1, 2002
- National University of Singapore and Institute of Microelectronics
- En Tang Kang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Epoxy resin compositions for liquid encapsulation
- Patent number 6,274,650
- Issue date Aug 14, 2001
- Institute of Microelectronics
- Cheng Qiang Cui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Determination of oxidant or reductant concentration by the spectrop...
- Patent number 5,451,526
- Issue date Sep 19, 1995
- National University of Singapore
- Cheng Q. Cui
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Multiple integrated circuit die package with thermal performance
- Publication number 20110159640
- Publication date Jun 30, 2011
- Compass Technology Co., Inc.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT RING AND METHOD OF USE
- Publication number 20090134207
- Publication date May 28, 2009
- Poh Leng EU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die-up integrated circuit package with grounded stiffener
- Publication number 20080099898
- Publication date May 1, 2008
- Compass Technology Co., Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple integrated circuit die package with thermal performance
- Publication number 20080073777
- Publication date Mar 27, 2008
- Compass Technology Co. Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS

Cheng Q. Cui

Person

Patents Grantslast 30 patents

Multiple integrated circuit die package with thermal performance

Solder ball attachment ring and method of use

Multiple integrated circuit die package with thermal performance

Die-up integrated circuit package with grounded stiffener

Method for lamination of fluoropolymer to metal and printed circuit...

Method for low temperature lamination of metals to polyimides

Method for low temperature lamination of metals to fluoropolymers

Epoxy resin compositions for liquid encapsulation

Determination of oxidant or reductant concentration by the spectrop...

Patents Applicationslast 30 patents

Multiple integrated circuit die package with thermal performance

SOLDER BALL ATTACHMENT RING AND METHOD OF USE

Die-up integrated circuit package with grounded stiffener

Multiple integrated circuit die package with thermal performance