Cheng Sim Kee

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip module having a support structure and method of manufacture
- Patent number 8,586,413
- Issue date Nov 19, 2013
- Spansion LLC
- Yin Lye Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to die bonding
- Patent number 7,750,481
- Issue date Jul 6, 2010
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to bonding
- Patent number 7,674,653
- Issue date Mar 9, 2010
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to die bonding
- Patent number 7,554,204
- Issue date Jun 30, 2009
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-Chip Module and Method of Manufacture
- Publication number 20140061895
- Publication date Mar 6, 2014
- Spansion LLC
- Yin Lye FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to die bonding
- Publication number 20090091043
- Publication date Apr 9, 2009
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to bonding
- Publication number 20090093084
- Publication date Apr 9, 2009
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS
- Publication number 20090051043
- Publication date Feb 26, 2009
- SPANSION LLC
- Wai Loon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM
- Publication number 20090001599
- Publication date Jan 1, 2009
- SPANSION LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE
- Publication number 20080318364
- Publication date Dec 25, 2008
- SPANSION LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to die bonding
- Publication number 20080308947
- Publication date Dec 18, 2008
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module and method of manufacture
- Publication number 20060249826
- Publication date Nov 9, 2006
- Yin Lye Foong
- H01 - BASIC ELECTRIC ELEMENTS

Cheng Sim Kee

Person

Patents Grantslast 30 patents

Multi-chip module having a support structure and method of manufacture

Die offset die to die bonding

Die offset die to bonding

Die offset die to die bonding

Patents Applicationslast 30 patents

Multi-Chip Module and Method of Manufacture

Die offset die to die bonding

Die offset die to bonding

DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS

DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM

PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE

Die offset die to die bonding

Multi-chip module and method of manufacture