Cheng-Wen Chiu

Follow

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,455,159
- Issue date Sep 27, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 9,171,741
- Issue date Oct 27, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20160013074
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130115738
- Publication date May 9, 2013
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS