Cheng Why Tan

Person

Bukit Tengah, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Radiation-emitting semiconductor chip, optoelectronic component com...
- Patent number 10,879,424
- Issue date Dec 29, 2020
- OSRAM OLED GmbH
- Fabian Kopp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a light emitting semiconductor die
- Patent number 9,123,869
- Issue date Sep 1, 2015
- Intellectual Discovery Co., Ltd.
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a light emitting semiconductor die
- Patent number 7,919,787
- Issue date Apr 5, 2011
- Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging an image sensor and a packaged image sensor
- Patent number 7,745,897
- Issue date Jun 29, 2010
- Aptina Imaging Corporation
- Cheng Why Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High power light emitting diode device
- Patent number 7,612,386
- Issue date Nov 3, 2009
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat-top reflection-based optical encoders
- Patent number 7,495,583
- Issue date Feb 24, 2009
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Teong Swee Tan
- G01 - MEASURING TESTING
Information Patent Grant
Reflective encoder with interchangable lens on emitter-detector module
- Patent number 7,490,771
- Issue date Feb 17, 2009
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Cheng Why Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reflective encoders with various emitter-detector configurations
- Patent number 7,385,178
- Issue date Jun 10, 2008
- Avago Technologies ECBU IP Pte Ltd
- Yee Loong Chin
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a packaging device for semiconductor die and...
- Patent number 7,279,355
- Issue date Oct 9, 2007
- Avago Technologies ECBUIP (Singapore) Pte Ltd
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device for semiconductor die, semiconductor device incorp...
- Patent number 7,256,486
- Issue date Aug 14, 2007
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform deposition of organic layer
- Patent number 7,148,624
- Issue date Dec 12, 2006
- Osram Opto Semiconductors (Malaysia) Sdn. Bhd
- Ewald Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulating brittle substrates using transfer molding
- Patent number 7,114,939
- Issue date Oct 3, 2006
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Cheng Why Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Light-emitting diode incorporating gradient index element
- Patent number 7,102,177
- Issue date Sep 5, 2006
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Kee Siang Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physically compact device package
- Patent number 6,809,261
- Issue date Oct 26, 2004
- Agilent Technologies, Inc.
- Kee Y an Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source
- Patent number 6,806,583
- Issue date Oct 19, 2004
- Agilent Technologies, Inc.
- Huck Khim Koay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting an electronic device
- Patent number 6,242,280
- Issue date Jun 5, 2001
- Agilent Technologies, Inc.
- Huck Khim Koay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING AN OPT...
- Publication number 20230032550
- Publication date Feb 2, 2023
- Osram Opto Semiconductors GmbH
- Fabian KOPP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION-EMITTING SEMICONDUCTOR CHIP, OPTOELECTRONIC COMPONENT COM...
- Publication number 20180337309
- Publication date Nov 22, 2018
- Osram Opto Semiconductors GmbH
- Fabian Kopp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE
- Publication number 20110147788
- Publication date Jun 23, 2011
- Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE
- Publication number 20070272940
- Publication date Nov 29, 2007
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat-top reflection-based optical encoders
- Publication number 20070241943
- Publication date Oct 18, 2007
- Teong Swee Tan
- G01 - MEASURING TESTING
Information Patent Application
Reflective encoder with interchangable lens on emitter-detector module
- Publication number 20070205285
- Publication date Sep 6, 2007
- Cheng Why Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Reflective encoders with various emitter-detector configurations
- Publication number 20070090282
- Publication date Apr 26, 2007
- Yee Loong Chin
- G01 - MEASURING TESTING
Information Patent Application
Methods for packaging an image sensor and a packaged image sensor
- Publication number 20060268144
- Publication date Nov 30, 2006
- Cheng Why Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
High power light emitting diode device
- Publication number 20060138645
- Publication date Jun 29, 2006
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High power light emitting diode device
- Publication number 20050077616
- Publication date Apr 14, 2005
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging device for semiconductor die, semiconductor device incorp...
- Publication number 20040262738
- Publication date Dec 30, 2004
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a packaging device for semiconductor die and...
- Publication number 20040266058
- Publication date Dec 30, 2004
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical source having integral diffractive element
- Publication number 20040256628
- Publication date Dec 23, 2004
- Yee Loong Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging structure
- Publication number 20040217451
- Publication date Nov 4, 2004
- Sai-Mun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package with improved thermal performance
- Publication number 20040120117
- Publication date Jun 24, 2004
- Cheng-Why Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM DEPOSITION OF ORGANIC LAYER
- Publication number 20030214232
- Publication date Nov 20, 2003
- Ewald Guenther
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulating brittle substrates using transfer molding
- Publication number 20030194459
- Publication date Oct 16, 2003
- Cheng Why Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Light Source
- Publication number 20020047130
- Publication date Apr 25, 2002
- Huck Khim Koay
- H01 - BASIC ELECTRIC ELEMENTS

Cheng Why Tan

Person

Patents Grantslast 30 patents

Radiation-emitting semiconductor chip, optoelectronic component com...

Semiconductor device with a light emitting semiconductor die

Semiconductor device with a light emitting semiconductor die

Methods for packaging an image sensor and a packaged image sensor

High power light emitting diode device

Flat-top reflection-based optical encoders

Reflective encoder with interchangable lens on emitter-detector module

Reflective encoders with various emitter-detector configurations

Method for fabricating a packaging device for semiconductor die and...

Packaging device for semiconductor die, semiconductor device incorp...

Uniform deposition of organic layer

Encapsulating brittle substrates using transfer molding

Light-emitting diode incorporating gradient index element

Physically compact device package

Light source

Method of interconnecting an electronic device

Patents Applicationslast 30 patents

OPTOELECTRONIC SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING AN OPT...

RADIATION-EMITTING SEMICONDUCTOR CHIP, OPTOELECTRONIC COMPONENT COM...

SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE

Flat-top reflection-based optical encoders

Reflective encoder with interchangable lens on emitter-detector module

Reflective encoders with various emitter-detector configurations

Methods for packaging an image sensor and a packaged image sensor

High power light emitting diode device

High power light emitting diode device

Packaging device for semiconductor die, semiconductor device incorp...

Method for fabricating a packaging device for semiconductor die and...

Optical source having integral diffractive element

Semiconductor packaging structure

Electronic package with improved thermal performance

UNIFORM DEPOSITION OF ORGANIC LAYER

Encapsulating brittle substrates using transfer molding

Light Source